Scanning Acoustic Microscopy (SAM) and X-Ray Tomography

Posted by doEEEt Media Group
On April 26, 2022
0

The Scanning Acoustic Microscopy (SAM) technique is the most effective and complete non-destructive approach for the detection of critical and latent anomalies within plastic encapsulated parts, either on assembled or non-assembled systems

INSPECTION, ELECTRICAL & VERIFICATION, TESTING

Thickness Verification. An Introduction on HI-REL

Posted by Emilio Cano García
On April 10, 2022
0

Coating Thickness Verification The thickness of metallic coatings is routinely determined by X-ray fluorescence spectrometry. This provides a basis for assessing the quality of coated materials and therefore influences decisions regarding disposition (acceptability) of the coated product as well as control of coating processes.

INSPECTION, ELECTRICAL & VERIFICATION, PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

MIL-STD-883 METHOD 2003 – Solderability Testing

Posted by Manuel Padial Pérez
On July 23, 2020
0

The Mil-Std-883 Method 2003 Is One Of The Oldest And Most Widely Used Standards For Solderability Testing.

ALTER Laboratory Services

Solderability Test

Posted by Manuel Padial Pérez
On March 28, 2020
0

Solderability test refers to the process of evaluating the solderability of terminations (i.e., component leads, lugs, terminals, wires, etc.). which are normally joined by a soldering operation. The solderability determination is based on the ability of the terminations to be wetted by the molten solder after accelerated aging.

EEE Components, INSPECTION, ELECTRICAL & VERIFICATION, PASSIVES, PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Failure Analysis of Capacitors and Inductors

Posted by Kemet Electronic Corporation
On December 17, 2019
0

General construction of Tantalum, Aluminum electrolytic, Multi-layer Ceramics, Film, and Super capacitors and Common Mode Choke and Surface Mount inductors are explained.

ENDURANCE, ENVIRONMENTAL & RADIATION, INSPECTION, ELECTRICAL & VERIFICATION, TESTING

Video Digging into Circuit Alter Technology

Posted by doEEEt Media Group
On June 17, 2019
0

For satellite applications where failure is not an option, electronic components need to operate constantly on demand, and have to be free of failures during the lifetime of the satellite-which can be for many years. To ensure this requirement is met, the components are put through many hours of stress testing covering all thermal.

INSPECTION, ELECTRICAL & VERIFICATION, TESTING

XPS, how it works and its applications in EEE parts

Posted by Francisco Javier Aparicio Rebollo
On May 30, 2019
0

X-ray photoemission spectroscopy (XPS) also known as electron spectroscopy for chemical analysis (ESCA) is a surface-sensitive quantitative analysis method to accurately determine the elemental composition of solid materials. The technique is the most extended tool for the chemical characterization of thin films coatings and surfaces either for industrial applications as well as for research

INSPECTION, ELECTRICAL & VERIFICATION, TESTING

XRF tool, how it works and its applications in EEE parts

Posted by Francisco Javier Aparicio Rebollo
On May 16, 2019
0

XRF is a non-destructive and quick analytical tool to determine the chemical elements present in the specimen. In particular, it combines low detection limit (particularly in the case of heavy elements) with quick and easy sample preparation.