PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Which are the improper degrees of Crimped Connectors?

Posted by Francisco Javier Aparicio Rebollo
On August 21, 2020
0

Stress relaxation: decrease of the contact pressure held between the wires and at the wire-barrel interface, Improper crimping: neither damage the insulation of the wire strands nor to leave insulator residues over the stripped conductor. Diagnosis tools: improper degree of compression and related issues can be detected either

INSPECTION, ELECTRICAL & VERIFICATION, TESTING

Non-destructive internal inspection of EEE parts and passive components

Posted by Francisco Javier Aparicio Rebollo
On July 7, 2020
0

Non-destructive testing methods are critical for the screening, inspection and failure analysis of plastic encapsulated and other EEE systems.

INSPECTION, ELECTRICAL & VERIFICATION, TESTING

SAM Test methods: comparisons

Posted by Francisco Javier Aparicio Rebollo
On June 17, 2020
0

Additional testing: This deviation is considered as a reliability concern and additional tests must be conducted to check the system performance. From the point of view of the SAM inspection, such deviations do not comply with the acceptance criterion

C-SAM - Short Technical Notes, EEE Components, INSPECTION, ELECTRICAL & VERIFICATION, PASSIVES, TESTING

Scanning Acoustic Microscopy (C-SAM) of in Stacked Capacitors

Posted by Francisco Javier Aparicio Rebollo
On June 12, 2020
0

Scanning Acoustic Microscopy (C-SAM) inspection has been used for the comprehensive inspection of the lead-frame in a horizontally stacked capacitor. This non-destructive inspection reveals minor anomalies at the interface with capacitor terminals which may impair the electrical response.

INSPECTION, ELECTRICAL & VERIFICATION, TESTING

What is an External Visual Inspection?

Posted by David Ramirez - Cruzado
On May 21, 2020
0

Consists of a non-destructive optical inspection. Binoculars with magnification between 1x and 60x and with a relatively large and accessible field of view are employed for this purpose. The aim of this process is to verify the conformity of the exterior of electrical, electronic and electromechanical components (EEE parts) with the acquisition document.

INSPECTION, ELECTRICAL & VERIFICATION

Doing Incoming Inspection to identify potentially non-conforming parts

Posted by Antonio José Rey
On May 20, 2020
1

Incoming InspectionThe purpose of the incoming inspection is to identify potentially non-conforming parts, prior to placing the material in the inventory or moving it to the production flow. All parts and materials subject to receiving inspection are examined in accordance with customer purchase order requirements, drawings and standards, among others.

ENDURANCE, ENVIRONMENTAL & RADIATION, INSPECTION, ELECTRICAL & VERIFICATION, TESTING

Considering the risk of retinning on QFN package

Posted by Manuel Sánchez Ruiz
On May 19, 2020
0

The use of new packages on space market has come hand in hand with the introduction of commercial of the shelf (COTS) parts in the business and even more with the New Space needs.

C-SAM - Short Technical Notes, INSPECTION, ELECTRICAL & VERIFICATION, TESTING

Ultrasonic Examination of Ceramic Capacitors by Scanning Acoustic Microscopy

Posted by Francisco Javier Aparicio Rebollo
On May 18, 2020
0

Ultrasonic Examination of Ceramic Capacitors by Scanning Acoustic Microscopy (SAM) has proved to be the most effective tool for the non-destructive detection of very thin (even below 200 nm of thickness) internal anomalies (delamination, voids, cracks, and foreign material) within ceramic capacitors and other EEE parts

C-SAM - Short Technical Notes, Plastic Packaging for Space

C-SAM: Crack detection within plastic packages

Posted by Antonio José Rey
On May 8, 2020
0

Package crack/void between non-connected terminals is a critical anomaly in plastic encapsulated parts. This is so as these can turn into a conductive path and lead to catastrophic failures. In this regard, Scanning Acoustic Microscopy (SAM) is the most effective non-destructive approach for the sensitive detection of such deviations within plastic packages.

INSPECTION, ELECTRICAL & VERIFICATION, PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Studying Critical elements in PCB systems: Plated Through Via (PTV)

Posted by Mari Carmen López
On March 13, 2020
0

Plated Through Vias (PTV) are critical elements in PCB systems and special care must be paid during their inspection in order to ensure the reliability, as they are one the main factors that determine the PCB Quality. The functionality and reliability of PTVs are dictated by: the plated through hole architecture (height/diameter), plating (thickness and quality) and other PCB general characteristics (materials and design).

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