INSPECTION, ELECTRICAL & VERIFICATION, TESTING

SAM, the preferred method for the non-destructive internal inspection

Posted by doEEEt Media Group
On December 16, 2020
0

SAM, The Preferred Method For The Non-Destructive Internal Inspection. Scanning Acoustic Microscopy of COTS and plastic encapsulated microelectronics. Confocal Scanning Acoustic Microscopy (C-SAM) has proved to be the most effective non-destructive approach for the screening of COTS parts and the detection of latent internal anomalies in PEMs, either before soldering or for assembled systems.

INSPECTION, ELECTRICAL & VERIFICATION, TESTING

Scanning Electron Microscope – SEM/FIM – Inspections

Posted by Francisco Javier Aparicio Rebollo
On December 14, 2020
0

SEM available high magnification tool to analyze the design, construction or handling defects. It can be used to check the interconnect metallization on an integrated circuit: metal step coverage, etc., or for performing an in-depth technology study: reverse engineering, die cross sectioning, failure analysis, etc.

INSPECTION, ELECTRICAL & VERIFICATION, PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Looking at Device Internal Structure by a Cross sectioning of EEE Parts

Posted by Francisco Javier Aparicio Rebollo
On November 27, 2020
0

The cross-sectioning process provides access to the device internal structure, its materials and design. Such components as diodes and capacitors and silicon dice are often subjected to cross-sectioning to detect the defects which could not be found using other testing techniques.

INSPECTION, ELECTRICAL & VERIFICATION, Plastic Packaging for Space

SAM: Main Issues in Plastic Encapsulated Systems

Posted by Francisco Javier Aparicio Rebollo
On November 17, 2020
0

Plastic Encapsulated COTS offers Lower procurement cost, Shorter procurement time, More performance and functionality available nad Reduced size and weight. An inherent risk of PEMs is related to Lack of hermeticity, The mismatch with the thermomechanical properties of the inorganic internal part and Plastic Encapsulated COTS

INSPECTION, ELECTRICAL & VERIFICATION, TESTING

Internal Visual Inspection of Hi-Rel EEE Parts

Posted by David Ramirez - Cruzado
On November 6, 2020
0

The aim of this destructive test is to demonstrate that the internal materials, design, construction, and assembly of EEE parts are in accordance with the applicable acquisition document. This test can also be performed to examine unsealed devices prior to capping to verify that no damage and/or defects have appeared as a result of prior testing (see Pre-cap Inspection).

PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Bond Pull Test

Posted by Jesús Enrique Barbero Muñoz
On October 14, 2020
0

The purpose of Bond Pull Test is to measure bond strengths, to evaluate bond strength distributions and to determine compliance with specified bond strength requirements of the applicable acquisition document in order to ensure the proper manufacturing process and long-term reliability of the bonds under stress conditions, such as vibration, shock, thermal cycling or wearout phenomena.

PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Why Crimped Connector Mechanics Failure?

Posted by Francisco Javier Aparicio Rebollo
On September 21, 2020
0

Crimped connectors are extensively present in EEE systems because of the good performance and easier installation at reduced dimension. Due to the key role played, they are required to have high durability even under harsh operating conditions. In the case of unexpected/early failure, thorough diagnosis and deep understanding of the main failure causes are the starting point to preclude future occurrence and improve the system reliability.

INSPECTION, ELECTRICAL & VERIFICATION, TESTING

SAM: Test flow and procedures

Posted by Francisco Javier Aparicio Rebollo
On September 17, 2020
0

Nowadays scanning acoustic microscopy (SAM) is extensively used in the non-destructive inspection of microelectronic devices and is present in different space verification programs; particularly for plastic-encapsulated electronic components. This is so due to the ability to image the internal morphology, location, size and distribution of hidden features including different types of flaws.

INSPECTION, ELECTRICAL & VERIFICATION, TESTING

Radiographic Inspection 3D X-Ray – 2D

Posted by José Cándido Vázquez Cárdeno
On September 14, 2020
0

The purpose of radiographic inspection is to detect internal physical defects which are not otherwise visible in electronic components. The radiographic techniques reveal such flaws as the presence of foreign objects, improper interconnecting wires, inhomogeneities in materials, improper positioning of elements, voids in the die attach material or encapsulating, etc.

PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Why do a Residual Gas Analysis?

Posted by Dimas Morilla
On August 28, 2020
0

Residual Gas Analysis, also known as Internal Gas Analysis (IGA), is a destructive test which is performed to examine the atmosphere inside hermetically sealed devices. The test procedure is based on milling the component so that the gas content can be extracted and subsequently analyzed. The measurement of the moisture content is of particular interest as it allows to determine whether the moisture criteria are met. Also, the measurement of all the other gases might be of interest as the gas content reflects upon the quality of the sealing process and can cause long term reliability problems such as corrosion, fogging, leakage, etc.

Page 4 of 7«‹2 345 6 ›»