Blog Image
INSPECTION, ELECTRICAL & VERIFICATION, TESTING

Scanning Microscopy Equipment our new adquisition

  • Posted by Francisco Javier Aparicio Rebollo
  • On December 13, 2021
  • 0
ALTER TECHNOLGY upgrades its Scanning Acoustic Microscopy capabilities. Alter Technology has upgraded its Scanning Acoustic Microscopy capabilities by acquiring a new FineSAT V acoustic microscope from Hitachi. FineSAT V, the high-end model of the FineSAT series, combines advanced inspection features with the faster inspection speed currently available in the market.
Read More
Blog Image
INSPECTION, ELECTRICAL & VERIFICATION, TESTING

Industry Applications where C-SAM is used

  • Posted by Francisco Javier Aparicio Rebollo
  • On November 29, 2021
  • 0
C-SAM is a reliable and powerful tool for the non-destructive testing of microelectronic parts and base materials. Moreover, it is mandatory for different applications such as those described below for different sectors. In order to provide a fast reply to our customer needs our Virtual Lab platform for Remote Testing grants immediate access to our test results and fast communication with our engineers during and after the test.
Read More
Blog Image
PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Lead Integrity Test, How to be perform

  • Posted by Jesús Enrique Barbero Muñoz
  • On October 15, 2021
  • 0
Lead integrity test is performed to determine the integrity of the device leads (terminals), welds and seals. During the execution of this test, the DUT is subjected to various stresses including tension, bending fatigue and torque. The stresses to be applied depend on the DUT characteristics and on the corresponding test method.
Read More
Blog Image
Optoelectronics, TESTING

Development of a NIR-VIS-UV lidar echo emulator

  • Posted by Pawel Adamiec
  • On October 7, 2021
  • 0
The LEE capable of emulating the echoes of a spatial lidar at three wavelengths (355 nm, 532 nm, and 1064 nm) was developed. In general, it enables the characterization of the critical optical parameters of the detection chain of a space or airborne lidar. The LEE allows short overlapping echo with long echo with 63 dB dynamic range. In-depth characterization of the lidar detection module will evaluate compliance with the requirements for which it was designed and feed future designs with actual figures from the lidar detection chain.
Read More
Blog Image
Optoelectronics

LIDAR echo emulator

  • Posted by Pawel Adamiec
  • On October 7, 2021
  • 0
The LIDAR Echo Emulator (LEE) emulates the returned signals from a Lidar system. As the return signal of a Lidar system depends on the target, this implies the capability of shaping the laser’s returns. In brief, a long echo corresponds to a natural or diffusive object (canopy, clouds) and short echoes to a complex thing like roofs, ground, etc. Such signals must be simulated to study and validate new detectors and detection systems without developing/procuring the entire Lidar system.
Read More
Blog Image
ALTER Laboratory Services, ENDURANCE, ENVIRONMENTAL & RADIATION, INSPECTION, ELECTRICAL & VERIFICATION, TESTING

New climatic chamber

  • Posted by doEEEt Media Group
  • On October 6, 2021
  • 0
New acquisition will allow us to increase our current Environmental capabilities and offer the best price and delivery time in the market for the thermal treatment of your products, PCBs, as part of the Product Validation according to most of the industry standards ECSS-Q-ST-70-08C, ECSS-Q-ST-70-38C, JESD22-104, IEC 61646 10.11, IEC 60068-3-5…
Read More
Blog Image
ACTIVES, C-SAM - Short Technical Notes, EEE Components, TESTING

Thermo-mechanical Analyser – TMA – capabilities

  • Posted by Raquel Cano Cordero
  • On October 5, 2021
  • 0
The thermomechanical analysis (TMA) of plastic encapsulated microelectronic and COTS parts is a fundamental technique to avoid (during the design and fabrication stage) and foresee anomalies related to the deformation of packages with temperature. Thus, this is a very effective tool to disclose and screen out possible reliability concerns related to the thermo-mechanical integrity and stability of the devices.
Read More
Blog Image
ALTER Laboratory Services, INSPECTION, ELECTRICAL & VERIFICATION, TESTING

Thermo-Mechanical Analysis

  • Posted by Raquel Cano Cordero
  • On August 9, 2021
  • 0
The thermomechanical analysis (TMA) of plastic encapsulated microelectronic, and COTS parts is a fundamental technique to avoid (during the design and fabrication stage) and foresee anomalies related to the deformation of packages with temperature. Thus, this is a very effective tool to disclose and screen out possible reliability concerns related to the thermo-mechanical integrity and stability of the devices.
Read More
doEEEt.com