Blog Image
SiC Testing

SiC Testing and Properties

  • Posted by doEEEt Media Group
  • On December 11, 2020
  • 0
Space qualified silicon carbide power diodes developed by CNM-CSIC in collaboration with ALTER TECHNOLOGY will be handled as ALTER TECHNOLOGY specific product for high reliability and harsh environment-related markets.
Read More
Blog Image
ACTIVES, EEE Components, ENDURANCE, ENVIRONMENTAL & RADIATION, INSPECTION, ELECTRICAL & VERIFICATION, Non-standard testing, TESTING

SiC Schottky Blocking Diode for BepiColombo Solar Array

  • Posted by doEEEt Media Group
  • On December 10, 2020
  • 0
Alter Technology as reference test house Screening of a high number of devices under very harsh conditions: Custom testing setup High Temperature: 270ºC Low temp: -170ºC High Voltage tests: 250V High Power tests: 2.5A Long lasting tests with constant monitoring of electrical parameters and temperature of each single diode.
Read More
Blog Image
EEE Components, PASSIVES

Integrated Passives Market Gets Active

  • Posted by doEEEt Media Group
  • On May 6, 2020
  • 0
Integrated passive devices are seeing greater use within system-in-package technology and numerous applications, including the Internet of Things. The tiny devices are making their way into automotive electronics, consumer electronics, and health-care products, among other uses.
Read More
Blog Image
EEE Components, PASSIVES

Capacitance Package, Minimizing Footprint while Maximizing

  • Posted by Kemet Electronic Corporation
  • On April 17, 2020
  • 0
KEMET KONNEKT™ package allows two to four ceramic capacitors to be stacked vertically or horizontally while retaining the integrity of the part. It uses transient liquid phase sintering (TLPS) technology to bond component terminations together. The KONNEKT™ U2J capacitors can be used in both orientations, thus minimizing the component footprint, while maximizing the bulk capacitance of a stacked MLCC with design flexibility in mind.
Read More
doEEEt.com