KOA Introduces High Power Ceramic Cased Resistors for Automotive Pre-Charge / Discharge

Posted by doEEEt Media Group
On March 9, 2021
0

KOA is introducing a new range of wire wound and metal oxide high power resistors in a ceramic case, dedicated to automotive pre-charge/discharge applications.

EEE Components, PASSIVES

Top ten harsh environment resistors

Posted by doEEEt Media Group
On September 11, 2020
0

Here are 10 resistor lines introduced this year that deliver high reliability, high stability, or high temperature performance for a range of applications that require more robust performance.

EEE Components, PASSIVES

Best Practices & Advises for Antenna Tuning

Posted by doEEEt Media Group
On April 29, 2020
0

Connectivity is key in today’s world and devices in the market require strong signal strength to allow for peak performance. Integrating an antenna is not trivial, whether it is an off-the-shelf product or a highly customized solution, and should not be an afterthought. AVX Ethertronics white paper discusses antenna design considerations.

EEE Components, PASSIVES

Koa Speer Releases New High Voltage HV73V Thick Film Chip Resistor

Posted by doEEEt Media Group
On April 29, 2020
0

The HV73V features a special inner electrode material that makes the resistor suitable for high voltages. The new HV73V achieves maximum working voltages 2.5 times higher with improved temperature cycling stability compared to standard resistors. The HV73V is available in the following chip sizes and voltages: 0603: 350VAC, 0805: 400VAC, 1206: 800VAC.

EEE Components, PASSIVES

KOA Corporation Releases Current Sense Resistors with T.C.R. ±50×10-6/K

Posted by doEEEt Media Group
On March 18, 2020
0

KOA now released Current Sense Chip Resistors SLP series. The resistance range is from 10ｍ to 100ｍΩ and T.C.R. is ±50×10-6/K.

2nd PCNS Passive Components Networking Symposium

Posted by doEEEt Media Group
On June 17, 2019
0

Leading passive components manufacturers will discuss hot products, application notes and latest technology during the 2nd Passive Components Networking Symposium on 11th September 2019 in Bucharest, Romania