EEE Components, INSPECTION, ELECTRICAL & VERIFICATION, PASSIVES, PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Platinum Temperature Sensors Solderability Issues

Posted by Manuel Sánchez Ruiz
On May 27, 2022
0

Thermistors or Resistance Temperature Detectors (RTD) using platinum finished leads are widely used in the space market, having provided service to many scientific missions.

INSPECTION, ELECTRICAL & VERIFICATION, TESTING

Material Analysis Techniques for Electronic Components

Posted by Francisco Javier Aparicio Rebollo
On May 6, 2022
0

Material Analysis is performed to detect and identify the materials used in the manufacturing of semiconductors and microelectronic parts and packages. One particular use of this analysis is the detection of prohibited materials, especially in the lead finish, to identify potential reliability issues such as undesirable whisker growth caused by pure tin finishes. Lead finish validation for every component type to be soldered is essencial to determine the correct soldering profile.

INSPECTION, ELECTRICAL & VERIFICATION, TESTING

Thickness Verification. An Introduction on HI-REL

Posted by Emilio Cano García
On April 10, 2022
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Coating Thickness Verification The thickness of metallic coatings is routinely determined by X-ray fluorescence spectrometry. This provides a basis for assessing the quality of coated materials and therefore influences decisions regarding disposition (acceptability) of the coated product as well as control of coating processes.

PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Hermeticity testing techniques: Seal Test, Fine & Gross Leak in EEE Parts

Posted by Francisco Javier Aparicio Rebollo
On May 2, 2021
0

The purpose of the seal test is to determine the effectiveness of the sealing of components with internal cavities, i.e. to determine their hermeticity. Defective sealing may permit the entrance of contaminants, thus reducing the effective life and reliability of devices.

PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Resistance To Solvent the Importance marking testing on EEE Parts

Posted by Jesús Enrique Barbero Muñoz
On March 28, 2021
0

The purpose of this test is to verify that the markings on component parts will not become illegible when subjected to solvents (e.g. during the board cleaning process after parts assembly) or during normal handling, and that the solvents employed for the test will not cause deleterious, mechanical or electrical damage or deterioration of the materials or finishes. The applicable test standards are MIL-STD-750 method 1022, MIL-STD-883 method 2015, or ESCC 24800, among others, depending on the part type.

ENGINEERING AND PROJECT MANAGEMENT SUPPORT

Post Procurement and Components Control/Validation

Posted by Susana Galdeano
On February 3, 2021
0

Once the pre-procurement and procurement activities have been considered, the project manager and the different team members will ensure that the whole process to validate commercial components is performed accordingly in a timely manner.

ENGINEERING AND PROJECT MANAGEMENT SUPPORT

Components Procurement Requirements

Posted by Susana Galdeano
On February 3, 2021
0

The preferred procurement channel is through the manufacturers, and if not, through duly authorised/franchised distributors, which allow minimizing the risk of delivery of counterfeit parts. In any case, a specific anti-counterfeit policy will be applied and all required test to be performed to validate the authenticity of the parts upon reception of the parts.

Alter Technology Services, ENGINEERING AND PROJECT MANAGEMENT SUPPORT

General trend of price and leadtime increases in the Semiconductor Industry

Posted by María Eugenia Turrión
On January 12, 2021
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World Semiconductor Trade Statistics predicts that chip sales will accelerate to 8.4% growth next year, reaching $469 billion in revenue. For 2020, it estimated that chip sales would rise 5.1% to $433 billion. That’s after semiconductor industry sales fell 12% to $412 billion in 2019. Semiconductor industry sales returned to growth this year despite disruptions from the Covid-19 pandemic.

ALTER Laboratory Services, EEE Components, Optoelectronics, PASSIVES, RF & MW

What engineering and parts logistics services for EEE parts can be performed?

Posted by Emilio Cano García
On December 11, 2020
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As part of a comprehensive service to our customers, Alter Technology controls every phase of the product’s logistics from the manufacturer to the final delivery to the customer. The status of each component can easily be checked through our web-based reporting tools.

INSPECTION, ELECTRICAL & VERIFICATION, PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

MIL-STD-883 METHOD 2003 – Solderability Testing

Posted by Manuel Padial Pérez
On July 23, 2020
0

The Mil-Std-883 Method 2003 Is One Of The Oldest And Most Widely Used Standards For Solderability Testing.

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