The struggle of finding rad-hard power MOSFET

Posted by José Francisco Largaespada
On November 14, 2019
0

Power MOSFET’s are a key element of many electronic designs where high power management is needed. They are used in almost any power supply application (for example as switches). However, the fact that they are key, doesn’t mean necessarily that we have a wide number of rad-hard power MOSFET providers.

ACTIVES, EEE Components

Microchip SA.45s SPACE CSAC (Chip-Scale Atomic Clock)

Posted by Manuel Sánchez Ruiz
On November 13, 2019
0

As a way of measuring time, atomic clocks have proven to be more precise than clocks using earth movement as a base for time calculation.

ACTIVES, EEE Components

RTG4 Radiation Tolerant FPGA Update

Posted by Manuel Sánchez Ruiz
On November 13, 2019
0

Microsemi, a Microchip Company is one of the top market developers of FPGA for the Space market.

ACTIVES, EEE Components

SAMV71Q21RT and UT32M0R500 Microcontrollers Comparison

Posted by Manuel Sánchez Ruiz
On June 25, 2019
0

Two microcontrollers for space, the ATSAMV71Q21RT from Microchip Technology Nantes (formerly Atmel) and the UT32M0R500 from Cobham Microelectronic Solutions (formerly Aeroflex), are compared in this post

ENDURANCE, ENVIRONMENTAL & RADIATION, INSPECTION, ELECTRICAL & VERIFICATION, TESTING

Video Digging into Circuit Alter Technology

Posted by doEEEt Media Group
On June 17, 2019
0

For satellite applications where failure is not an option, electronic components need to operate constantly on demand, and have to be free of failures during the lifetime of the satellite-which can be for many years. To ensure this requirement is met, the components are put through many hours of stress testing covering all thermal.

EEE Components, PASSIVES

Radiation Characterisation for New Tantalum Polymer Capacitors

Posted by doEEEt Media Group
On June 14, 2019
0

Polymer tantalum capacitor technology was developed in response to demands from the market to lower the ESR of tantalum capacitors while preserving their small case size and high reliability. The technology is promising in several aspects. The higher quality interface between the dielectric and the polymer cathode increases the breakdown voltage of the device, as well as reducing its DC leakage current, even at extreme radiation exposure conditions.

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