Material Analysis is performed to detect and identify the materials used in the manufacturing of semiconductors and microelectronic parts and packages. One particular use of this analysis is the detection of prohibited materials, especially in the lead finish, to identify potential reliability issues such as undesirable whisker growth caused by pure tin finishes. Lead finish validation for every component type to be soldered is essencial to determine the correct soldering profile.
The pre-procurement phase combines the EEE parts state-of-the-art analysis, risk analysis and component ownership cost optimization with regards to the mission requirements, design criticality and budget.
In order to achieve this, the project manager leading a multidisciplinary team must find the optimal balance between component information availability (traceability, materials, testing, previous use…) and minimum tests to perform, reaching an acceptable level of reliability covering the technical, schedule and costing constraints.
Coating Thickness Verification
The thickness of metallic coatings is routinely determined by X-ray fluorescence spectrometry. This provides a basis for assessing the quality of coated materials and therefore influences decisions regarding disposition (acceptability) of the coated product as well as control of coating processes.