ACTIVES, EEE Components, INSPECTION, ELECTRICAL & VERIFICATION, PASSIVES, PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Flow Stages in Vibration Testing on Hi-Rel EEE Parts

Posted by María Teresa Rodríguez
On May 25, 2019
0

Depending on the intended application electrical components are exposed to either transitory or permanent dynamic mechanical stress which can impair the performance (e.g. mechanically induced crack in PCBs systems or fretting corrosion in connectors and others).

PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

How can failures in vibration tests be avoided?

Posted by María Teresa Rodríguez
On May 16, 2019
0

As it has been mentioned in “Vibration Test on Hi-Rel for EEE Parts”, vibration tests are important to check the reliability of the components/assemblies. These tests can be a headache and suppose a great cost if the design of the device and the fixing tool are not properly done. Simulation tools are the key to anticipate to the problems reducing costs and lead times.

ACTIVES, EEE Components

ASIC DESIGN SUPPORT CAPABILITIES

Posted by Sonia Vargas
On May 16, 2019
0

An ASIC is an application specific integrated circuit, which is usually designed to cover a need of functionality or performance (speed, power consumption, dimensions, etc.) that cannot be achieved by a combination of preexistent integrated circuits. The design of an ASIC implies the interoperability of complex tools. In the figure, it can be observed a simplified flow for a low power mixed-signal ASIC design, where both the digital and analog flow will converge via open access.

EEE Components, PASSIVES

MLCC cracking issues in low voltage is report & evaluates by NASA

Posted by Tomáš Zedníček
On May 15, 2019
0

Report prepared by Alexander Teverovsky, ASRC Federal Space and Defense. NASA recently released an extensive 70pages report on low voltage MLCC cracking issues published on nepp.nasa.gov. The report in detail describes the manufacturing process of MLCC types, provide comparative analyses of MIL, NASA vs ESA vs JAXA specifications, explains qualification procedures and cracking risk issues including degradation and failure mechanisms. The final section recommends methods for workmanship and failure detection.

INSPECTION, ELECTRICAL & VERIFICATION, TESTING

What is SEM EDS as Internal Material Analysis?

Posted by Francisco Javier Aparicio Rebollo
On May 2, 2019
0

This analytic technique may provide both qualitative and quantitative information of the composition of a surface, i.e. identification of the elements and the element weights, respectively. The technique relies on the detection and spectroscopy of secondary radiation (X-Ray) emitted when a high-intensity incident beam of electrons impinges upon the materials placed in its path. The SEM – EDS Internal Material Analysis (also known as EDX or EDAX) can be performed in accordance with MIL-STD-883, MIL-STD-750, MIL-STD-1580 and ESCC 25500 requirements.

INSPECTION, ELECTRICAL & VERIFICATION, TESTING

Thermographic analysis Techniques used for EEE Parts

Posted by Emilio Cano García
On March 28, 2019
0

Thermographic analysis techniques used in Alter Technolgy : Infrared camera thermal maps, Thermal behavior of equipment and cabinets, Thermal analysis at customer specified temperature conditions. The analysis of the distribution of the dissipated heat in cabinets or enclosures gives relevant information for checking the reliability of a system and its components.

ENDURANCE, ENVIRONMENTAL & RADIATION, TESTING

Thermal Vacuum Testing for Space Applications

Posted by doEEEt Media Group
On March 28, 2019
0

The environmental conditions in the space are extreme, the combination of low pressure and the extreme temperatures can cause the failure of a component. That is why we test the components in similar conditions.

INSPECTION, ELECTRICAL & VERIFICATION, TESTING

Identifying Leakage Pathway with a Penetrant Dye Gross Leak Test

Posted by David Ramirez - Cruzado
On March 13, 2019
0

Penetrant dye gross leak test is used to identify leakage pathways within hermetic and non-hermetic devices, such as glass body devices or plastic encapsulated parts. The test provides a definitive view of the leak paths including cracks, voids, delaminations and other fractures.

PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

DC power – Use of Substrate Attach Strength – Die Shear Strength Method

Posted by José Cándido Vázquez Cárdeno
On February 13, 2019
0

The purpose of the test is to determine the strength of the element attachment system when subjected to force in the Y1 axis, and thus to determine the integrity of materials and processes used to attach semiconductor die or surface mounted elements to package headers or other substrates. The implementation of this test includes material evaluation and process control.

PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Test Methods in Electronic parts. The Vibration Tests

Posted by María Teresa Rodríguez
On February 13, 2019
2

The purpose of vibration tests is to evaluate the effect caused on component parts by vibration in a specified frequency range. The samples are subjected to testing under different conditions, as described below, in accordance with the respective applicable standards. The test conditions differ in terms of duration, frequency range, vibration waveform, amplitude, etc.

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