MLCC cracking issues in low voltage is report & evaluates by NASA

Posted by Tomáš Zedníček
On May 15, 2019
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Report prepared by Alexander Teverovsky, ASRC Federal Space and Defense. NASA recently released an extensive 70pages report on low voltage MLCC cracking issues published on nepp.nasa.gov. The report in detail describes the manufacturing process of MLCC types, provide comparative analyses of MIL, NASA vs ESA vs JAXA specifications, explains qualification procedures and cracking risk issues including degradation and failure mechanisms. The final section recommends methods for workmanship and failure detection.

ABC of CLR, EEE Components, PASSIVES, PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Hi-Rel EEE Parts Mounting Techniques Overview

Posted by Tomáš Zedníček
On April 30, 2019
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IR reflow soldering IR infrared “convection” reflow is commonly used in commercial large volume SMD components mounting process. The main differences in reflow soldering processes and oven types lie in heat transfer methods – radiation, conduction, convection, and condensation. In fact, all heat transfers are used in modern reflow ovens. The heat is applied from above, below, or all directions dependent on the equipment being used. In classical infrared “radiation” reflow ovens, several ceramic heaters are transferring the heat to the assemblies, moving through the oven on a conveyor belt, by radiation.