USB-C Power Board Design Consideration

Posted by doEEEt Media Group
On May 25, 2020
0

USB charging has come a long way since the first #USB device was invented. Check out this video to learn everything you need to know about USBC Power Delivery.

ALTER Laboratory Services

Solderability Test

Posted by Manuel Padial Pérez
On March 28, 2020
0

Solderability test refers to the process of evaluating the solderability of terminations (i.e., component leads, lugs, terminals, wires, etc.). which are normally joined by a soldering operation. The solderability determination is based on the ability of the terminations to be wetted by the molten solder after accelerated aging.

ABC of CLR, EEE Components, PASSIVES, PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Mounting Guidelines: PCB Board Design and Handling

Posted by Tomáš Zedníček
On February 27, 2020
0

Board Design and Component Pre-Assembly Preparation The leads of leaded components shall be bent and often cut to the right length before they are mounted/soldered to the substrate. Lead cutting, bending and mounting are operations that may be hazardous if they are not performed properly.

Microsectioning - Short Technical Notes, PASSIVES, PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Assembled Resistors. Incomplete wetting

Posted by Mari Carmen López
On January 15, 2020
0

Resistors assembled to a PCB have been submitted to the ECSS verification program. Metallographic analysis allows us to check the status of such devices after performing the environmental tests (Vibration & Thermal Cycling).

INSPECTION, ELECTRICAL & VERIFICATION, PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Degolding on NiPdAu finish

Posted by Manuel Sánchez Ruiz
On December 30, 2019
0

The use of gold (Au) finish on military and space qualified parts provides useful protection to the base material of leads during storage of the parts. The use of a gold layer over the barrier metal on the lead avoids the appearance of corrosion.

INSPECTION, ELECTRICAL & VERIFICATION, PHYSICAL, MECHANICAL & ASSEMBLY

Hot Solder Dip Acceptance Criteria

Posted by Antonio Rodríguez Arenas
On December 20, 2019
0

Hot Solder Dip Acceptance Criteria for Flat Pack Packages. Different standards can be considered to determine the acceptance of the Hot Solder Dip activity on EEE components

INSPECTION, ELECTRICAL & VERIFICATION, TESTING

Kemet Flexible EMI/RFI Suppressor Sheets

Posted by Manuel Padial Pérez
On September 29, 2019
0

The KEMET noise suppression sheets are designed for the high-frequency noise that is generated from the electronic devices

IMPACT-IAAC 2019

Posted by Elena Vallejo
On July 11, 2019
0

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EEE Components, EVENTS, PASSIVES

Assembly, Capacitors, EPCI PCNS, Resistors, Sponsored

Posted by doEEEt Media Group
On June 28, 2019
0

Passive Components Mounting Guidelines Workshop. The Passive Components Mounting Guidelines Workshop is dedicated to anyone interested in passive component mounting issues and impact of board mounting process to the reliability of the components.

EEE Components, EVENTS, PASSIVES

Passive Components in 3D Packaging: The View from ECTC

Posted by doEEEt Media Group
On June 27, 2019
0

Some of the technical sessions of The Electronic Components and Technology Conference (ECTC) were focused on research involving the embedding and integration of passive components in 3D configurations.

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