ABC of CLR, EEE Components, PASSIVES, PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Mounting Guidelines: Soldering, PCB Handling & Rework

Posted by Tomáš Zedníček
On October 18, 2020
1

What are the optimum soldering conditions and solder fillet? The best solder fillet for all SMT applications is one which makes a reliable connection and which best withstands the environmental exposures of the products with minimum degradation. This fillet is difficult to describe quantitatively for all parts. The optimum fillet ranges in height from about 1/3 to 2/3 of the part termination height. This does not mean that all solder joints outside of this range should be repaired. It does mean that this is the target for the process engineer to reach for in his process. As many as possible of the solder fillets on the board should be in this range.

EEE Components, INSPECTION, ELECTRICAL & VERIFICATION, PASSIVES, TESTING

Analysis of Multi-Layer Ceramic Capacitors

Posted by doEEEt Media Group
On October 14, 2020
0

This paper presents an overview of MLCCs characteristics that are of interest when used in power integrity (PI) analysis of automotive electronic systems.

EEE Components, PASSIVES

New PCBs on 3D printer, When are we going to print?

Posted by Tomáš Zedníček
On October 4, 2020
1

The development of PCB 3D printers is potentially linked with a number of topics and challenges that can be closely related to passive components. The question I asked myself about 3D PCB printing capabilities was also inhibited by the current shortage of certain passive components.

EEE Components, ENDURANCE, ENVIRONMENTAL & RADIATION, Microsectioning - Short Technical Notes

Inspection of conformal coating on PCB using UV Light

Posted by Mari Carmen López
On August 4, 2020
0

The aim of the external inspection of coated PCA is to determine if all the surfaces and devices are adequately covered. In order to make easy such inspection, fluorescing agents can be added to the polymeric formulation, which shows a blue glow when the PCA is exposed to ultraviolet (UV) light.

Microsectioning - Short Technical Notes, PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Evaluation of PCB in Alter Technology Lab.

Posted by Mari Carmen López
On July 25, 2020
0

The separation of the interest area has to be performed in such a way as to prevent any damage by deformation or input of heat. After cleaning, the specimen is encapsulated before the grinding process takes place.

INSPECTION, ELECTRICAL & VERIFICATION, PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

MIL-STD-883 METHOD 2003 – Solderability Testing

Posted by Manuel Padial Pérez
On July 23, 2020
0

The Mil-Std-883 Method 2003 Is One Of The Oldest And Most Widely Used Standards For Solderability Testing.

ACTIVES, EEE Components, PASSIVES

Anticipate EMC with LTSPICE

Posted by doEEEt Media Group
On July 21, 2020
0

Würth Elektronik Webinar

Usually simulation focuses on the functional aspects of an electronic device, however with a bit of practice, a simple and free tool such as LTSPICE can be used to simulate EMC behavior of any device.

These simulations provides a good opportunity to use LTSPICE Components Libraries from Würth Elektronik to solve...

Microsectioning - Short Technical Notes, PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Evaluation of Electronic Assemblies

Posted by Mari Carmen López
On July 18, 2020
0

Assembly process of THT or SMT onto PCBs for spacecraft applications follow well-established design requirements based on specifications prepared by ECSS (ECSS-Q-ST-70-08C & ECSS-Q-ST-70-38C), NASA and IPC (IPC-6012).

Microsectioning - Short Technical Notes, PHYSICAL, MECHANICAL & ASSEMBLY

Failure Analysis in Microsection Inspection

Posted by Mari Carmen López
On July 10, 2020
0

Microsection analysis is performed on an assembled through hole device as a part of a failure analysis. Cross-section through the plane of interest can provide helpfully information about solder defects, PCB inner layers and internal construction. As a part of a failure analysis, the plane of interest has to be selected taking into account PCB characteristic, observed failure and previous test results.

PHYSICAL, MECHANICAL & ASSEMBLY, TESTING, WEBINAR

Scanning Acoustic Microscopy – Webinar

Posted by doEEEt Media Group
On June 17, 2020
2

This webinar provides a brief overview of Scanning Acoustic Microscopy and the inspection of EEE parts. Thus, you will acquire, in a friendly way, the knowledge to interpret SAM images and to conceive basic SAM inspections. The webinar is mainly focused on the plastic encapsulated systems. In addition, we will also show other interesting application examples.

Page 3 of 51 234 5