ACTIVES, EEE Components, INSPECTION, ELECTRICAL & VERIFICATION, PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

MICROCHIP FPGAs External Visual Inspection Considerations

Posted by Antonio Rodríguez Arenas
On January 20, 2020
0

One of the quality assurance inspections that are performed in EEE parts is external visual inspection. The applicable method for Microchip FPGAs as well as for other parts with generic specification MIL-PRF-38535, is MIL-STD-883 Method 2009.

INSPECTION, ELECTRICAL & VERIFICATION, PHYSICAL, MECHANICAL & ASSEMBLY

Hot Solder Dip Acceptance Criteria

Posted by Antonio Rodríguez Arenas
On December 20, 2019
0

Hot Solder Dip Acceptance Criteria for Flat Pack Packages. Different standards can be considered to determine the acceptance of the Hot Solder Dip activity on EEE components

ACTIVES, EEE Components

DLA SMD Part Numbering Breakdown

Posted by Manuel Padial Pérez
On December 18, 2019
0

SMD stands for Standard Microcircuit Drawing, which refers to documents generated by the US Defense Logistics Agency Land and Maritime (DLA), the former Defense Supply Center Columbus (DSCC).

ACTIVES, EEE Components

RTG4 Radiation Tolerant FPGA Update

Posted by Manuel Sánchez Ruiz
On November 13, 2019
0

Microsemi, a Microchip Company is one of the top market developers of FPGA for the Space market.

ACTIVES, EEE Components

76% of IC product categories to see flat or negative growth

Posted by doEEEt Media Group
On September 11, 2019
0

Three-quarters of all IC product categories are expected to see flat or negative growth this year

ACTIVES, EEE Components

CRANE INTERPOINT NEW MSA+ SERIES 15-50 Vin

Posted by Manuel Padial Pérez
On September 3, 2019
0

Crane Interpoint has announced the introduction of a new, higher-power, MSA+ as a drop-in replacement for Crane’s MSA

ACTIVES, EEE Components, SPECIFICATIONS / QPLs

Issue 3 Of Detail Specification ESCC 9202/083

Posted by Emilio Cano García
On July 31, 2019
0

What have been the changes in Issue 3 of ESCC Detail Specification 9202/083?

ACTIVES, EEE Components

IC Content in Electronic Systems Forecast to Drop to 26.4% in 2019

Posted by doEEEt Media Group
On July 25, 2019
0

While the trend of increasing semiconductor content has been evident for the past 30 years, the big jump in 2017 and 2018 was primarily due to the huge surge in DRAM and NAND flash

ACTIVES, EEE Components

SAMV71Q21RT and UT32M0R500 Microcontrollers Comparison

Posted by Manuel Sánchez Ruiz
On June 25, 2019
0

Two microcontrollers for space, the ATSAMV71Q21RT from Microchip Technology Nantes (formerly Atmel) and the UT32M0R500 from Cobham Microelectronic Solutions (formerly Aeroflex), are compared in this post

ACTIVES, EEE Components

Low Voltage Differential Signaling (LVDS) overview

Posted by Manuel Padial Pérez
On June 24, 2019
1

This post shows the basis to understand the Low Voltage Differential Signaling (LVDS) technology, including the benefits over other technologies, as well as different kind of devices and configurations available.

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