Microcircuit Standards Development for Space Missions

Posted by doEEEt Media Group
On August 1, 2023
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This presentation will describe the efforts underway where NEPAG has worked with DLA (Defense Logistics Agency), JC-13 (the manufacturers of government products), and CE-12 (the users of active devices) committees to ensure current military/aerospace standards address many challenges, one example being the insertion of new technology, the Class Y initiative, Class Y represents advancements in packaging technology, increasing functional density, and increasing operating frequency.

ACTIVES, EEE Components, MANUFACTURER NOTIFICATION

AMD completes acquisition of Xilinx

Posted by Javier Alejandro de la Ossa Fernández
On February 25, 2022
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Acquisition of Xilinx in an all-stock transaction. creates the industry’s high-performance and adaptive computing leader with significantly expanded scale and the strongest portfolio of leadership computing, graphics, and adaptive SoC products.

ACTIVES, EEE Components, PASSIVES, SPECIFICATIONS / QPLs

Issue 222 of ESCC QUALIFIED PART LIST (QPL)

Posted by Javier Alejandro de la Ossa Fernández
On November 15, 2021
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This post provides information about the latest changes in issue 222 of ESCC QUALIFIED PART LIST (QPL) included in the DCR 1474.

ACTIVES, EEE Components

Ceramic Hermetic DDR2 SDRAM Memory avalaible for Space

Posted by Manuel Padial Pérez
On September 13, 2021
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DDC's 97D2H is a hermetically sealed ceramic DDR2 SDRAM Memory for space and features high-speed operation with up to 8 Gbits of memory. Optional RAD-PAK® shielding provides greater total dose tolerance, to support missions with greater radiation exposure

ACTIVES, EEE Components

Radiation Tolerant Solid State Drives (SSD)

Posted by Manuel Padial Pérez
On September 1, 2021
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Aerospace developers and Space engineers are looking towards non-volatile memories such as NAND flash and solid state drives as alternatives for mass storage in space applications

ACTIVES, EEE Components, MANUFACTURER NOTIFICATION

Microchip’s Low-Power Radiation-Tolerant (RT) PolarFire® FPGA Enables High-Bandwidth Space Systems with Lower Total System Cost

Posted by Microchip Technology
On July 18, 2021
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Developers of spacecraft electronics use radiation-tolerant (RT) field programmable gate arrays (FPGAs) to create on-board systems that meet the demanding performance needs of future space missions, survive the brutal launch process and continue to operate reliably in the harsh environment of space

ACTIVES, EEE Components, MANUFACTURER NOTIFICATION

CRANE INTERPOINT Redmond Facility move to Lynnwood

Posted by Manuel Padial Pérez
On July 3, 2021
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Crane Interpoint facility located in Redmond, (WA), has been relocated to Crane’s existing Lynnwood, WA site

EEE Components, PASSIVES, SPECIFICATIONS / QPLs

Issue 218 of ESCC QUALIFIED PART LIST (QPL)

Posted by Javier Alejandro de la Ossa Fernández
On June 22, 2021
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This post provides information about the latest changes in issue 218 of ESCC QUALIFIED PART LIST (QPL) included in the DCR 1430.

ACTIVES, EEE Components

Radiation Hardened Integrated Circuits made in Germany

Posted by Manuel Padial Pérez
On June 21, 2021
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SPACE IC includes in its portfolio three space/radiation-hardened integrated circuits: SPPL12420RH point of load converter, and SPLVDS031RH/SPLVDS032RH a pair of quad LVDS line driver and receiver

ACTIVES, EEE Components

Plastic Rad Tolerant Microchip Products for New Space

Posted by Manuel Padial Pérez
On February 26, 2021
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Microchip’s AVR8 ATmegaS64M1/ATmegaS128 and ARM32 M7 SAMV71Q21 Flight Models (FM) are available in ceramic package with screening equivalent to QML class Q and QML class V quality levels. Engineering samples are available as well. Developing radiation-hardened systems for space applications means long lead times and high cost toward achieving the necessary levels of reliability for multi-year missions in harsh environments.

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