Wide Bandgap Materials: The Future of High Power Density, High Efficiency Circuits

Posted by Kemet Electronic Corporation
On May 25, 2020
0

Wide bandgap semiconductors provide between three and 10 per cent higher power conversion efficiency than standard silicon semiconductors, which can be critical power savings for battery-based applications such as electric vehicles and high power applications like server farms.

EEE Components, PASSIVES

Best Ceramic Technologies for High Power Density Applications?

Posted by Kemet Electronic Corporation
On May 14, 2020
0

Capacitors are increasingly being recognized for having the potential to improve efficiency and power density. Read about ceramic technology guidelines for high power density circuits.

EEE Components, PASSIVES

Capacitors Can Help With ESD Too

Posted by doEEEt Media Group
On May 14, 2020
0

The data speed of the signals, traces, and ICs to be protected are something that must be carefully considered. In general, the faster the signal the less cap that can be safely placed on it.

EEE Components, PASSIVES

Solutions To Meet The New VW 80808 Passive

Posted by Kemet Electronic Corporation
On May 11, 2020
0

As one of the largest automakers in the world, Volkswagen many times sets the standard for components in that can be used in the automotive industry. Recently, they have introduced the VW80808 standard which can be thought of as similar to the AEC-Q200 standard set forth by the Automotive Engineering Council.

EEE Components, PASSIVES

Solutions To Meet The New VW80808 Standard

Posted by Kemet Electronic Corporation
On May 11, 2020
0

As one of the largest auto makers in the world, Volkswagen many times sets the standard for components in that can be used in the automotive industry. Recently, they have introduced the VW80808 standard which can be thought of as similar to the AEC-Q200 standard set forth by the Automotive Engineering Council.

EEE Components, MANUFACTURER NOTIFICATION, PASSIVES

KEMET Announces Completion of SAMR and CFIUS Review

Posted by Kemet Electronic Corporation
On May 11, 2020
0

KEMET Corporation announcement on 27th April on Foreign Investment in the United States (CFIUS) that notified the parties that it completed review of the pending acquisition of KEMET by Yageo and determined that there are no unresolved national security concerns with respect to the transaction.

EEE Components, PASSIVES

On Board Chargers | KEMET Webinar

Posted by Kemet Electronic Corporation
On May 7, 2020
0

The growth of battery electric vehicles necessarily means growth in charging technologies. This webinar looks at onboard charging solutions and their accompanying passive components.

EEE Components, PASSIVES

Understanding Ripple Voltage Based on Different Types of Capacitors

Posted by Kemet Electronic Corporation
On April 29, 2020
0

William Mak, Kemet senior application engineer from KAIC lab demonstrates how four different capacitor types Aluminum, Aluminum polymer, Tantalum polymer and Ceramics affect the ripple voltage on a boost or buck regulator. Each technology of capacitors is compared using the KAIC-RCE-001 board, which uses the same output capacitance bank at the output of a switching regulator....

EEE Components, PASSIVES

KEMET Introduces Metal Composite Power Inductors for Automotive Applications

Posted by Kemet Electronic Corporation
On April 29, 2020
0

The MPXV series is optimized for use within the automotive market, where the increased demand and adoption for electronic systems necessitates high efficiency, low self-heating, and low power losses. The MPXV series inductors’ metal composite core has class-leading high permeability to meet these requirements. The qualities of the MPXV inductors make them ideal for use in designs where thermal considerations are vital to avoid adverse effects to other critical systems.

EEE Components, PASSIVES

Signal Transformer Announces HCTC Series of Common Mode Toroidal Chokes

Posted by doEEEt Media Group
On April 28, 2020
0

The HCTC Series features a solid carrier base for stable vertical PCB mounting and fixed-pin spacing for easy PCB insertion, high current capacity and excellent EMI suppression, which provides flexibility in the selection process with multiple options to choose from.

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