Automotive Semiconductor Back End Test Methods and Product Reliability Monitoring
- Posted by doEEEt Media Group
- On August 1, 2023
- 0
This paper aims to give an overview of the usual control steps during the manufacturing of semiconductors at the back end of the line; testing methods used to improve the detectability of expected failure mechanisms, and even to reduce the failure rate by including screening steps by the final testing area and to show possible strategies for product reliability monitoring.