INSPECTION, ELECTRICAL & VERIFICATION, PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Studying Critical elements in PCB systems: Plated Through Via (PTV)

Posted by Mari Carmen López
On March 13, 2020
0

Plated Through Vias (PTV) are critical elements in PCB systems and special care must be paid during their inspection in order to ensure the reliability, as they are one the main factors that determine the PCB Quality. The functionality and reliability of PTVs are dictated by: the plated through hole architecture (height/diameter), plating (thickness and quality) and other PCB general characteristics (materials and design).

INSPECTION, ELECTRICAL & VERIFICATION, PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Plated Through Via (PTV) Manufacturing Defects

Posted by Mari Carmen López
On March 13, 2020
0

The performance of PCB systems are sensitive to variations in the plating thickness of its vias, depends on the current/time in the copper plating bath and the throwing power. Insufficient plating thickness reduces the mechanical and thermal properties of the board and may lead to fatigue or overstress cracking, such us corner cracking and barrel cracking described below.

INSPECTION, ELECTRICAL & VERIFICATION, PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Why occur Thermomechanical Failures in Plated Through Vias (PTV)?

Posted by Francisco Javier Aparicio Rebollo
On March 6, 2020
0

Failures in plated through vias (PTV) can be related to different causes, some of them discussed elsewhere. Amongst them, thermomechanical fatigue is the most frequent failure mechanism observed in plated through systems. Hence, the present post analyses the typical thermally induced failures in PTV architectures.

ACTIVES, EEE Components, ENDURANCE, ENVIRONMENTAL & RADIATION, PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Hermetic Packages in Space Environment

Posted by Javier Alejandro de la Ossa Fernández
On February 27, 2020
0

The general specification for hybrid microcircuits (MIL-PRF-38534) details the qualification and testing requirements for non-hermetic packages for military and space applications, and the MIL-PRF-38535 proposed class Y monolithic microcircuits for non-hermetic space level.

ALTER Innovation, EEE Components, ENDURANCE, ENVIRONMENTAL & RADIATION, Non-standard testing, TESTING

Radiation test on optical materials

Posted by doEEEt Media Group
On February 13, 2020
0

The talk about Radiation test on optical materials will give a general introduction on testing optical materials for use in radiation environments.

ALTER Innovation, EEE Components

High Brightness Semiconductor Lasers as Transmitters for Space Lidar Systems

Posted by Pawel Adamiec
On February 13, 2020
0

High brightness semiconductor lasers are potential transmitters for future space lidar systems. In the framework of the European Project BRITESPACE, we propose an all semiconductor laser source for an Integrated Path Differential Absorption lidar system for column-averaged measurements of atmospheric CO2 in future satellite missions.

Optoelectronics Components Testing

Optoelectronic Components for Integration into Space

Posted by doEEEt Media Group
On February 13, 2020
0

Spacecraft structural health-monitoring applications are pushed forward by increased constraints in the cost of launching payloads into orbit that dictates major reduction in structural weight only attained through the use of advanced materials and innovative manufacturing methods.

ALTER Projects, ENDURANCE, ENVIRONMENTAL & RADIATION, INSPECTION, ELECTRICAL & VERIFICATION, PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Solar Orbiter

Posted by doEEEt Media Group
On January 14, 2020
0

Solar Orbiter will be used to examine how the Sun creates and controls the heliosphere, the vast bubble of charged particles blown by the solar wind into the interstellar medium. The spacecraft will combine in situ and remote sensing observations to gain new information about the solar wind, the heliospheric magnetic field, solar energetic particles, transient interplanetary disturbances and the Sun’s magnetic field.

ALTER Projects

ExoMars

Posted by doEEEt Media Group
On January 13, 2020
0

The ExoMars 2016 Trace Gas Orbiter (TGO) and an ESA-built EDM stationary lander called ‘Schiaparelli’ will be launched in March 2016. The TGO will deliver the stationary lander and then proceed to map the sources of methane and other gases on Mars, and in doing so, will help to select the landing site for the ExoMars 2018 rover (to be launched in 2018 on a Russian heavy lift Proton launch vehicle). T

INSPECTION, ELECTRICAL & VERIFICATION, PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Crimped Connectors, What about Reliability and Testing?

Posted by Mari Carmen López
On January 13, 2020
1

Crimping together with wire wrapping and spring clip systems are the preferred alternatives for the solderless connection of electrical conductors. In particular, crimped connectors offer several advantages such as: Gas-tightness and protection against oxidation and corrosive environments, High mechanical strength is inherent to the lack of alloys in the mechanical joint, Large versatility in terms of the wire diameters.

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Tag: HI-REL MATERIAL PROCESSES