COTS and implication on assembly verification and reliability: ESA Approach

Posted by doEEEt Media Group
On August 1, 2023
0

Cots utilization requires a different approach to assessing the reliability of the assembly processes. A brief overview of the difference between the high rel with a high rel assembly built to ECSS standard is provided, and the approach identified in the ESA Cots guidelines for assessing the assembly processes is briefly presented.

ALTER Laboratory Services, ENDURANCE, ENVIRONMENTAL & RADIATION, INSPECTION, ELECTRICAL & VERIFICATION, TESTING

New climatic chamber

Posted by doEEEt Media Group
On October 6, 2021
0

New acquisition will allow us to increase our current Environmental capabilities and offer the best price and delivery time in the market for the thermal treatment of your products, PCBs, as part of the Product Validation according to most of the industry standards ECSS-Q-ST-70-08C, ECSS-Q-ST-70-38C, JESD22-104, IEC 61646 10.11, IEC 60068-3-5…

PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Why Microsectioning sample preparation of PCB systems?

Posted by Mari Carmen López
On May 19, 2021
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Microsectioning sample preparation is an essential tool for the detailed materialographic inspection of EEE parts, including solder joints on PCB systems involving both surface mounting technology (SMT) and through hole technology (THT). In reveals critical information regarding the structural characteristics and the workmanship quality that is not accessible by other techniques.

INSPECTION, ELECTRICAL & VERIFICATION, PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Press-Fit connectors qualification for space

Posted by Francisco Javier Aparicio Rebollo
On May 15, 2021
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The burgeoning demand for the incorporation of disruptive technologies into space industry clearly requires fast and reliable procedures for the space qualification of these innovative components.

INSPECTION, ELECTRICAL & VERIFICATION, TESTING

When to use the Focused Ion Beam (FIB) Micro-Sectioning technique

Posted by Francisco Javier Aparicio Rebollo
On February 21, 2021
0

Focused ion beam, also known as ion milling, is a technique used particularly in the semiconductor industry and materials science for site-specific analysis, deposition and ablation of materials

ENDURANCE, ENVIRONMENTAL & RADIATION, TESTING

What does Electrothermal events in Crimped Connectors refer to?

Posted by Francisco Javier Aparicio Rebollo
On February 21, 2021
0

Electrothermal events. Electrothermal event refers to abnormal temperature increase leading to malfunction or catastrophic fails. The high temperature reached during such event activates or initiates some of the failure mechanism explained before, such as the growth of insulation oxide layers and outgassing processes responsible for organic contamination. Besides the formation of nonconductive layers at the contact interface, high temperature can also cause to the degradation of plastic insulators and contribute to multiple short circuit conditions.

INSPECTION, ELECTRICAL & VERIFICATION, TESTING

Using a Fluorescence Microscopy + dye penetrant test on EEE Parts

Posted by Francisco Javier Aparicio Rebollo
On February 19, 2021
0

The Fluorescence Microscopy + dye penetrant test is a technique that combines two inspection methods commonly used for the detection of surface anomalies such as cracks, porosity, laps, delaminations, and other discontinuities.

ENDURANCE, ENVIRONMENTAL & RADIATION, INSPECTION, ELECTRICAL & VERIFICATION, PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

A comparison between Red Plague screening methods

Posted by Manuel Sánchez Ruiz
On February 1, 2021
0

Red Plague is problematic corrosion appearing on silver-plated copper conductors. An electromechanical reaction is induced between copper core and silver plating of the conductor (by means of moisture and oxygen present in the silver-copper interface). Wire affected by Red Plague is mechanically compromised, increasing the failure risk linked to severe vibration and shock conditions on space flight.

INSPECTION, ELECTRICAL & VERIFICATION, TESTING

Scanning Electron Microscope – SEM/FIM – Inspections

Posted by Francisco Javier Aparicio Rebollo
On December 14, 2020
0

SEM available high magnification tool to analyze the design, construction or handling defects. It can be used to check the interconnect metallization on an integrated circuit: metal step coverage, etc., or for performing an in-depth technology study: reverse engineering, die cross sectioning, failure analysis, etc.

INSPECTION, ELECTRICAL & VERIFICATION, TESTING

What is Infrared Radiation (IR) used for in electronic devices?

Posted by Francisco Javier Aparicio Rebollo
On December 6, 2020
0

The continuous development and rise of integrated electronic devices is continually decreasing the typical distances and dimensions of their elemental components. Miniaturization is accompanied by problems due to excessive internal heating, to the extent that it is responsible for critical failures. For instance, inappropriate dissipation and heat generation can lead to reduced electron mobility. In integrated circuits and other microelectronic systems, the dimension of the generated hot-spots can be limited at the micrometric or submicrometric range. Hence, such thermal singularities required for of advanced diagnostic techniques capable of detecting temperature gradients at the microscopic scale

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