INSPECTION, ELECTRICAL & VERIFICATION, TESTING

Voids on sealing area.

Posted by Pedro CARABIAS LÓPEZ
On February 10, 2020
0

Preliminary observation during the External Visual inspection about possible sealing area defects is not enough to confirm the fault. Additional criteria are provided in this post

ALTER Projects, ENDURANCE, ENVIRONMENTAL & RADIATION, TESTING

Full Authority Digital Engine Control

Posted by doEEEt Media Group
On January 13, 2020
0

When aircraft manufacturers started to install just two seats instead of three in airliner cockpits in the 1980s, this was something of a mini-revolution. Since that time, planes have generally been flown by just the pilot and co-pilot.

EEE Components, INSPECTION, ELECTRICAL & VERIFICATION, PASSIVES, PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Failure Analysis of Capacitors and Inductors

Posted by Kemet Electronic Corporation
On December 17, 2019
0

General construction of Tantalum, Aluminum electrolytic, Multi-layer Ceramics, Film, and Super capacitors and Common Mode Choke and Surface Mount inductors are explained.

EEE Components, ENDURANCE, ENVIRONMENTAL & RADIATION, PASSIVES

Most Reliable/Efficient and Price Effective Solid Tantalum Capacitors

Posted by doEEEt Media Group
On October 18, 2019
1

Usage of the commercial (automotive) Tantalum capacitors with a traditional 50% derating can be a more expensive, less reliable, and less efficient solution, especially, at higher application voltages

INSPECTION, ELECTRICAL & VERIFICATION, PHYSICAL, MECHANICAL & ASSEMBLY, SPECIFICATIONS / QPLs, TESTING

Updates of ESCC 21001: Destructive Physical Analysis (DPA) of EEE Components

Posted by José Francisco Largaespada
On October 7, 2019
0

What are the typical set of tests included as part of Destructive Physical Analysis (DPA) of EEE Components?

ENDURANCE, ENVIRONMENTAL & RADIATION, INSPECTION, ELECTRICAL & VERIFICATION, TESTING

Video Digging into Circuit Alter Technology

Posted by doEEEt Media Group
On June 17, 2019
0

For satellite applications where failure is not an option, electronic components need to operate constantly on demand, and have to be free of failures during the lifetime of the satellite-which can be for many years. To ensure this requirement is met, the components are put through many hours of stress testing covering all thermal.

INSPECTION, ELECTRICAL & VERIFICATION, TESTING

XPS, how it works and its applications in EEE parts

Posted by Francisco Javier Aparicio Rebollo
On May 30, 2019
0

X-ray photoemission spectroscopy (XPS) also known as electron spectroscopy for chemical analysis (ESCA) is a surface-sensitive quantitative analysis method to accurately determine the elemental composition of solid materials. The technique is the most extended tool for the chemical characterization of thin films coatings and surfaces either for industrial applications as well as for research

INSPECTION, ELECTRICAL & VERIFICATION, TESTING

XRF tool, how it works and its applications in EEE parts

Posted by Francisco Javier Aparicio Rebollo
On May 16, 2019
0

XRF is a non-destructive and quick analytical tool to determine the chemical elements present in the specimen. In particular, it combines low detection limit (particularly in the case of heavy elements) with quick and easy sample preparation.

INSPECTION, ELECTRICAL & VERIFICATION, TESTING

What is SEM EDS as Internal Material Analysis?

Posted by Francisco Javier Aparicio Rebollo
On May 2, 2019
0

This analytic technique may provide both qualitative and quantitative information of the composition of a surface, i.e. identification of the elements and the element weights, respectively. The technique relies on the detection and spectroscopy of secondary radiation (X-Ray) emitted when a high-intensity incident beam of electrons impinges upon the materials placed in its path. The SEM – EDS Internal Material Analysis (also known as EDX or EDAX) can be performed in accordance with MIL-STD-883, MIL-STD-750, MIL-STD-1580 and ESCC 25500 requirements.

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