The continuous development and rise of integrated electronic devices is continually decreasing the typical distances and dimensions of their elemental components. Miniaturization is accompanied by problems due to excessive internal heating, to the extent that it is responsible for critical failures. For instance, inappropriate dissipation and heat generation can lead to reduced electron mobility. In integrated circuits and other microelectronic systems, the dimension of the generated hot-spots can be limited at the micrometric or submicrometric range. Hence, such thermal singularities required for of advanced diagnostic techniques capable of detecting temperature gradients at the microscopic scale

As typical length in integrated circuits decreases thermal management is becoming a key factor determining the reliability and lifetime of such systems. Furthermore, micrometric and submicrometric objects in integrated circuits modify local heat transport and may lead to the formation of unintentional hot-spots. Thus, the accurate measurement of the local temperature with micrometric spatial resolution is crucial to confirm the suitable operation of highly integrated systems.