INSPECTION, ELECTRICAL & VERIFICATION, PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Why occur Thermomechanical Failures in Plated Through Vias (PTV)?

Posted by Francisco Javier Aparicio Rebollo
On March 6, 2020
0

Failures in plated through vias (PTV) can be related to different causes, some of them discussed elsewhere. Amongst them, thermomechanical fatigue is the most frequent failure mechanism observed in plated through systems. Hence, the present post analyses the typical thermally induced failures in PTV architectures.

Optoelectronics Components Testing

Optoelectronic Components for Integration into Space

Posted by doEEEt Media Group
On February 13, 2020
0

Spacecraft structural health-monitoring applications are pushed forward by increased constraints in the cost of launching payloads into orbit that dictates major reduction in structural weight only attained through the use of advanced materials and innovative manufacturing methods.

EEE Components, INSPECTION, ELECTRICAL & VERIFICATION, PASSIVES, PHYSICAL, MECHANICAL & ASSEMBLY, SPECIFICATIONS / QPLs, TESTING

Cracking Problems in Low-Voltage Chip Ceramic Capacitors

Posted by doEEEt Media Group
On October 14, 2019
0

Guidelines for Selection of Ceramic Capacitors for Space Applications: Cracking Problems in Low-Voltage Chip Ceramic Capacitors

INSPECTION, ELECTRICAL & VERIFICATION, TESTING

High Rel Principles and Verifications in Solid Tantalum Capacitors

Posted by Kemet Electronic Corporation
On October 2, 2019
0

Typical short circuit failure mode in Tantalum capacitors can lead to significant damage to the adjacent circuit board, and 50%voltage de-rating alone is not sufficient to address this problem.

EEE Components, MANUFACTURER NOTIFICATION, PASSIVES

Mini Systems Thin Film Division Will Use PECVD Process

Posted by Manuel Padial Pérez
On July 31, 2019
0

The Product/Process Change Notification (PCN) #19-001 informs about the changes in the deposition method of dielectric material, silicon dioxide, used as a protective glassivation layer over thin-film resistors

INSPECTION, ELECTRICAL & VERIFICATION, PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Discover a PCB Failure Analysis: the Pad Cratering

Posted by Mari Carmen López
On March 11, 2019
0

One of the major failure modes encountered in PCB assembly is Pad cratering. This term is coined to describe a fracture at the pad/resin interface (adhesive failure) or within the resin beneath pads (cohesive failure) that extend along the whole pad length (see the figure) and leads to the complete separation of the pad from the PCB. This failure mode is especially relevant for assembled BGA, CGA and bottom termination components fabricated by lead-free and halogen-free processes and it is related to mechanical stresses experienced in PCB systems.

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Tag: EEE PARTS THERMAL SHOCK

Why occur Thermomechanical Failures in Plated Through Vias (PTV)?

Optoelectronic Components for Integration into Space

Cracking Problems in Low-Voltage Chip Ceramic Capacitors

High Rel Principles and Verifications in Solid Tantalum Capacitors

Mini Systems Thin Film Division Will Use PECVD Process

Discover a PCB Failure Analysis: the Pad Cratering