The SuperCam calibration target (SCCT)

Posted by Alina Spuma,
On July 5, 2021
0

The SuperCam calibration target (SCCT) carries a complex set of standards for imaging calibration, mineral identification and chemometric calculations or spectral references to calibrate and evaluate the health of the instrument basic.

Optoelectronics Components Testing

Thermal vacuum with video monitoring for HV optocouplers

Posted by Juan Moreno Echarri
On July 5, 2021
0

Exposure to vacuum may cause changes in filling isolating materials even at room temperature conditions. HV Optocouplers are used to connect two different circuits while maintaining high electrical isolation between them.

ACTIVES, ALTER Projects, EEE Components

HEATPACK: Higher thermal dissipation in space systems

Posted by Juan Moreno Echarri
On June 29, 2021
0

HEATPACK (High thErmAl efficiency componenTs PACKages for space) is the European effort to develop the next generation of low thermal resistance packages, in particular thanks to the implementation of state-of-the-art diamond-based composite materials and disruptive new heat sink solutions.

ENDURANCE, ENVIRONMENTAL & RADIATION, TESTING

Why is a necessary Thermal Shock Test in EEE Parts

Posted by Antonio Romero Mallén
On March 28, 2021
0

Electronic Components Thermal shock testing is performed to determine the ability of parts to function properly in an environment with sudden extreme changes in temperature. It is also used for accelerated testing during product evaluation and qualification process.

Microsectioning - Short Technical Notes, PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Evaluation of PCB in Alter Technology Lab.

Posted by Mari Carmen López
On July 25, 2020
0

The separation of the interest area has to be performed in such a way as to prevent any damage by deformation or input of heat. After cleaning, the specimen is encapsulated before the grinding process takes place.

EEE Components, PASSIVES

How KEMET makes Ceramic SMD Capacitors

Posted by Kemet Electronic Corporation
On July 12, 2020
0

Very interesting manufacturing video introducing basic steps how Kemet makes Multilayer Ceramic Capacitors (MLCCs).

EEE Components, PASSIVES

The top ten Capacitors for automative applications

Posted by doEEEt Media Group
On July 10, 2020
0

The automotive demand is not just for ICs like processors, memories, power, sensors…, passive components such as capacitors are needed to ensure high stability and interference-free designs

INSPECTION, ELECTRICAL & VERIFICATION, PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Studying Critical elements in PCB systems: Plated Through Via (PTV)

Posted by Mari Carmen López
On March 13, 2020
0

Plated Through Vias (PTV) are critical elements in PCB systems and special care must be paid during their inspection in order to ensure the reliability, as they are one the main factors that determine the PCB Quality. The functionality and reliability of PTVs are dictated by: the plated through hole architecture (height/diameter), plating (thickness and quality) and other PCB general characteristics (materials and design).

INSPECTION, ELECTRICAL & VERIFICATION, PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Plated Through Via (PTV) Manufacturing Defects

Posted by Mari Carmen López
On March 13, 2020
0

The performance of PCB systems are sensitive to variations in the plating thickness of its vias, depends on the current/time in the copper plating bath and the throwing power. Insufficient plating thickness reduces the mechanical and thermal properties of the board and may lead to fatigue or overstress cracking, such us corner cracking and barrel cracking described below.

INSPECTION, ELECTRICAL & VERIFICATION, PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Why occur Thermomechanical Failures in Plated Through Vias (PTV)?

Posted by Francisco Javier Aparicio Rebollo
On March 6, 2020
0

Failures in plated through vias (PTV) can be related to different causes, some of them discussed elsewhere. Amongst them, thermomechanical fatigue is the most frequent failure mechanism observed in plated through systems. Hence, the present post analyses the typical thermally induced failures in PTV architectures.

Page 2 of 3123