EEE Components, Microsectioning - Short Technical Notes, PASSIVES, PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

MacroVoids in assembled BGA packages

Posted by Mari Carmen López
On August 14, 2019
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BGA device assembled to a PCB has been submitted to the ECSS verification programme following the guideline defined in the ECSS standard ECSS-Q-ST-70-38C. Metallographic analysis allows us to check the status of such devices after performing the environmental tests (Vibration & Thermal Cycling).

ACTIVES, EEE Components, SPECIFICATIONS / QPLs

Review of main changes in generic specification MIL-PRF-55310 REV. F

Posted by José Francisco Largaespada
On July 19, 2019
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Space standards (such as ESCC and MIL standards) have helped throughout the years to develop the industry and to achieve de mission goals. Standards improve the competitiveness, efficiency and knowledge transfer within space business. However, standards are not frozen documents, but rather they must change and adapt to the current requirements of the industry and the new developments and knowledge gathered during all the years of space missions.

PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Soldering Verification of EEE parts SMD and PCBs

Posted by Mari Carmen López
On May 16, 2019
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High reliability assembled PCB prototypes as well as novel surface mounted devices (SMD) and mixed systems must be assessed according to well defined qualification test plans. Such high reliability verification programmes are not limited to just evaluate the robustness, reliability and performance of the product but they also address the verification of tools, fabrication procedures and involved materials, as well as the confirmation of product integrity. For instance, ECSS (European Cooperation for Space Standardization” (ECSS) standards used in space programs

INSPECTION, ELECTRICAL & VERIFICATION, PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Discover a PCB Failure Analysis: the Pad Cratering

Posted by Mari Carmen López
On March 11, 2019
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One of the major failure modes encountered in PCB assembly is Pad cratering. This term is coined to describe a fracture at the pad/resin interface (adhesive failure) or within the resin beneath pads (cohesive failure) that extend along the whole pad length (see the figure) and leads to the complete separation of the pad from the PCB. This failure mode is especially relevant for assembled BGA, CGA and bottom termination components fabricated by lead-free and halogen-free processes and it is related to mechanical stresses experienced in PCB systems.

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