Microsectioning - Short Technical Notes, PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Evaluation of PCB in Alter Technology Lab.

Posted by Mari Carmen López
On July 25, 2020
0

The separation of the interest area has to be performed in such a way as to prevent any damage by deformation or input of heat. After cleaning, the specimen is encapsulated before the grinding process takes place.

Microsectioning - Short Technical Notes, PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Evaluation of Electronic Assemblies

Posted by Mari Carmen López
On July 18, 2020
0

Assembly process of THT or SMT onto PCBs for spacecraft applications follow well-established design requirements based on specifications prepared by ECSS (ECSS-Q-ST-70-08C & ECSS-Q-ST-70-38C), NASA and IPC (IPC-6012).

EEE Components, PASSIVES

How KEMET makes Ceramic SMD Capacitors

Posted by Kemet Electronic Corporation
On July 12, 2020
0

Very interesting manufacturing video introducing basic steps how Kemet makes Multilayer Ceramic Capacitors (MLCCs).

EEE Components, PASSIVES

The top ten Capacitors for automative applications

Posted by doEEEt Media Group
On July 10, 2020
0

The automotive demand is not just for ICs like processors, memories, power, sensors…, passive components such as capacitors are needed to ensure high stability and interference-free designs

EEE Components, Microsectioning - Short Technical Notes, PASSIVES, PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Microsectioning inspection of assembled capacitors

Posted by Mari Carmen López
On May 9, 2020
0

Cross-sectioned ceramic capacitors were metallographically prepared in the Materials & Processes Laboratory, recognized as a recommended facility for such activity by the ESA authority (MEMO ESA-TECMSP-MO-013165).

ACTIVES, COTS, New Space, LEO Constellations, EEE Components

Microchip: Hirel Plastic Rad Tolerant (HP) products

Posted by Manuel Padial Pérez
On March 14, 2020
0

Microchip takes a proven automotive-qualified device and improves the silicon process to make the component immune to single-event latch-up in heavy ions, thus preventing destruction in the radiation environment of space.

INSPECTION, ELECTRICAL & VERIFICATION, PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Studying Critical elements in PCB systems: Plated Through Via (PTV)

Posted by Mari Carmen López
On March 13, 2020
0

Plated Through Vias (PTV) are critical elements in PCB systems and special care must be paid during their inspection in order to ensure the reliability, as they are one the main factors that determine the PCB Quality. The functionality and reliability of PTVs are dictated by: the plated through hole architecture (height/diameter), plating (thickness and quality) and other PCB general characteristics (materials and design).

INSPECTION, ELECTRICAL & VERIFICATION, PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Plated Through Via (PTV) Manufacturing Defects

Posted by Mari Carmen López
On March 13, 2020
0

The performance of PCB systems are sensitive to variations in the plating thickness of its vias, depends on the current/time in the copper plating bath and the throwing power. Insufficient plating thickness reduces the mechanical and thermal properties of the board and may lead to fatigue or overstress cracking, such us corner cracking and barrel cracking described below.

INSPECTION, ELECTRICAL & VERIFICATION, PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Why occur Thermomechanical Failures in Plated Through Vias (PTV)?

Posted by Francisco Javier Aparicio Rebollo
On March 6, 2020
0

Failures in plated through vias (PTV) can be related to different causes, some of them discussed elsewhere. Amongst them, thermomechanical fatigue is the most frequent failure mechanism observed in plated through systems. Hence, the present post analyses the typical thermally induced failures in PTV architectures.

ALTER Innovation, ENDURANCE, ENVIRONMENTAL & RADIATION, TESTING

Dedicated irradiators and facilities for material studies

Posted by doEEEt Media Group
On February 13, 2020
0

Space is a harsh environment due to vacuum, UV, temperature, vibration and radiation…etc. Before landing a space vehicle, devices and materials have to be tested at ground level in order to estimate the effect of all these parameters to know about irradiators.

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