INSPECTION, ELECTRICAL & VERIFICATION, PHYSICAL, MECHANICAL & ASSEMBLY

Hot Solder Dip Acceptance Criteria

Posted by Antonio Rodríguez Arenas
On December 20, 2019
0

Hot Solder Dip Acceptance Criteria for Flat Pack Packages. Different standards can be considered to determine the acceptance of the Hot Solder Dip activity on EEE components

EEE Components, INSPECTION, ELECTRICAL & VERIFICATION, PASSIVES, PHYSICAL, MECHANICAL & ASSEMBLY, SPECIFICATIONS / QPLs, TESTING

Cracking Problems in Low-Voltage Chip Ceramic Capacitors

Posted by doEEEt Media Group
On October 14, 2019
0

Guidelines for Selection of Ceramic Capacitors for Space Applications: Cracking Problems in Low-Voltage Chip Ceramic Capacitors

INSPECTION, ELECTRICAL & VERIFICATION, PHYSICAL, MECHANICAL & ASSEMBLY, SPECIFICATIONS / QPLs, TESTING

Updates of ESCC 21001: Destructive Physical Analysis (DPA) of EEE Components

Posted by José Francisco Largaespada
On October 7, 2019
0

What are the typical set of tests included as part of Destructive Physical Analysis (DPA) of EEE Components?

EEE Components, Microsectioning - Short Technical Notes, PASSIVES, PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

MacroVoids in assembled BGA packages

Posted by Mari Carmen López
On August 14, 2019
0

BGA device assembled to a PCB has been submitted to the ECSS verification programme following the guideline defined in the ECSS standard ECSS-Q-ST-70-38C. Metallographic analysis allows us to check the status of such devices after performing the environmental tests (Vibration & Thermal Cycling).

PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Soldering Verification of EEE parts SMD and PCBs

Posted by Mari Carmen López
On May 16, 2019
0

High reliability assembled PCB prototypes as well as novel surface mounted devices (SMD) and mixed systems must be assessed according to well defined qualification test plans. Such high reliability verification programmes are not limited to just evaluate the robustness, reliability and performance of the product but they also address the verification of tools, fabrication procedures and involved materials, as well as the confirmation of product integrity. For instance, ECSS (European Cooperation for Space Standardization” (ECSS) standards used in space programs

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