Component Testing for New Space Applications

Posted by Enrique Cordero
On July 2, 2021
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This standard describes the differences and the minimum testing requirements necessary to each of these three classes for evaluation, screening, and lot acceptance. The following test sequence shows the evaluation test sequence for class 1 components, this sequence is the same in the three classes described in the standard with different severity and test conditions to each class.

PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Why do a PIND test – Particle Impact Noise Detection

Posted by Adrián Cembrano Pérez
On March 11, 2021
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PIND ( Particle Impact Noise Detection Test ) testing is performed in order to detect the presence of loose particles inside a device cavity. Loose particle contamination is often caused by dirt, fibers, solder residues and other elements trapped inside the cavity during the sealing process. Loose particles can be a cause of electrical anomalies (or other physical problems) which in their turn can cause abnormal functioning of the parts and affect their reliability.

INSPECTION, ELECTRICAL & VERIFICATION, PHYSICAL, MECHANICAL & ASSEMBLY, SPECIFICATIONS / QPLs, TESTING

Updates of ESCC 21001: Destructive Physical Analysis (DPA) of EEE Components

Posted by José Francisco Largaespada
On October 7, 2019
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What are the typical set of tests included as part of Destructive Physical Analysis (DPA) of EEE Components?

ACTIVES, EEE Components

SAMV71Q21RT and UT32M0R500 Microcontrollers Comparison

Posted by Manuel Sánchez Ruiz
On June 25, 2019
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Two microcontrollers for space, the ATSAMV71Q21RT from Microchip Technology Nantes (formerly Atmel) and the UT32M0R500 from Cobham Microelectronic Solutions (formerly Aeroflex), are compared in this post