INSPECTION, ELECTRICAL & VERIFICATION, TESTING

Thickness Verification. An Introduction on HI-REL

Posted by Emilio Cano García
On April 10, 2022
0

Coating Thickness Verification The thickness of metallic coatings is routinely determined by X-ray fluorescence spectrometry. This provides a basis for assessing the quality of coated materials and therefore influences decisions regarding disposition (acceptability) of the coated product as well as control of coating processes.

PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Why Microsectioning sample preparation of PCB systems?

Posted by Mari Carmen López
On May 19, 2021
0

Microsectioning sample preparation is an essential tool for the detailed materialographic inspection of EEE parts, including solder joints on PCB systems involving both surface mounting technology (SMT) and through hole technology (THT). In reveals critical information regarding the structural characteristics and the workmanship quality that is not accessible by other techniques.

INSPECTION, ELECTRICAL & VERIFICATION, PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Press-Fit connectors qualification for space

Posted by Francisco Javier Aparicio Rebollo
On May 15, 2021
0

The burgeoning demand for the incorporation of disruptive technologies into space industry clearly requires fast and reliable procedures for the space qualification of these innovative components.

INSPECTION, ELECTRICAL & VERIFICATION, TESTING

Verifying the Structural Quality of the Glassivation Layer

Posted by Francisco Javier Aparicio Rebollo
On February 21, 2021
0

This test is performed to verify the structural quality of the glassivation layer in aluminum metalized semiconductor devices or microcircuits. The glassivation layer is a deposited dielectric film (e.g., CVD, sputtered of electron beam evaporated glass or nitride, etc.) and its good condition is essential to avoid such problems as electromigration.

INSPECTION, ELECTRICAL & VERIFICATION, TESTING

When to use the Focused Ion Beam (FIB) Micro-Sectioning technique

Posted by Francisco Javier Aparicio Rebollo
On February 21, 2021
0

Focused ion beam, also known as ion milling, is a technique used particularly in the semiconductor industry and materials science for site-specific analysis, deposition and ablation of materials

INSPECTION, ELECTRICAL & VERIFICATION, TESTING

Using a Fluorescence Microscopy + dye penetrant test on EEE Parts

Posted by Francisco Javier Aparicio Rebollo
On February 19, 2021
0

The Fluorescence Microscopy + dye penetrant test is a technique that combines two inspection methods commonly used for the detection of surface anomalies such as cracks, porosity, laps, delaminations, and other discontinuities.

ENDURANCE, ENVIRONMENTAL & RADIATION, INSPECTION, ELECTRICAL & VERIFICATION, PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

A comparison between Red Plague screening methods

Posted by Manuel Sánchez Ruiz
On February 1, 2021
0

Red Plague is problematic corrosion appearing on silver-plated copper conductors. An electromechanical reaction is induced between copper core and silver plating of the conductor (by means of moisture and oxygen present in the silver-copper interface). Wire affected by Red Plague is mechanically compromised, increasing the failure risk linked to severe vibration and shock conditions on space flight.

EEE Components, ENDURANCE, ENVIRONMENTAL & RADIATION, PASSIVES, TESTING

ESR Degradation in Polymer Tantalum Capacitors during Hi Temp Storage

Posted by doEEEt Media Group
On December 27, 2020
0

Different types of polymer capacitors from three manufacturers have been stored at temperatures from 100 ºC for periods up to 18,500 hours to 175 ºC for up to 2000 hours.

INSPECTION, ELECTRICAL & VERIFICATION, PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Looking at Device Internal Structure by a Cross sectioning of EEE Parts

Posted by Francisco Javier Aparicio Rebollo
On November 27, 2020
0

The cross-sectioning process provides access to the device internal structure, its materials and design. Such components as diodes and capacitors and silicon dice are often subjected to cross-sectioning to detect the defects which could not be found using other testing techniques.

EEE Components, ENDURANCE, ENVIRONMENTAL & RADIATION, PASSIVES, TESTING

New Whiskers Phenomena?

Posted by doEEEt Media Group
On August 1, 2020
0

Some PCBAs were submitted to a whisker test +85°C 85% RH for 200h duration and additional 2h from +85°C/85% RH-T° +25°C/50% RH 5 Cycles

Page 1 of 412 3 4