Analog to digital converters: The resolution dilemma

Posted by José Francisco Largaespada
On April 19, 2020
0

High resolution always pays the penalty of lower sampling rates, which can also derive in a poor representation of the analog signal

ALTER Laboratory Services

Solderability Test

Posted by Manuel Padial Pérez
On March 28, 2020
0

Solderability test refers to the process of evaluating the solderability of terminations (i.e., component leads, lugs, terminals, wires, etc.). which are normally joined by a soldering operation. The solderability determination is based on the ability of the terminations to be wetted by the molten solder after accelerated aging.

EEE Components, PASSIVES

Savers for ESCC Circular Connectors 38999 Type

Posted by Manuel Sánchez Ruiz
On January 24, 2020
0

ESCC (European Space Components Coordination) released several Detail Specifications to guide European manufacturers on the manufacture and testing of the different series of MIL-DTL-38999 (series I, series II and series III) for Space applications.

ACTIVES, EEE Components, INSPECTION, ELECTRICAL & VERIFICATION, PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

MICROCHIP FPGAs External Visual Inspection Considerations

Posted by Antonio Rodríguez Arenas
On January 20, 2020
0

One of the quality assurance inspections that are performed in EEE parts is external visual inspection. The applicable method for Microchip FPGAs as well as for other parts with generic specification MIL-PRF-38535, is MIL-STD-883 Method 2009.

INSPECTION, ELECTRICAL & VERIFICATION, PHYSICAL, MECHANICAL & ASSEMBLY

Hot Solder Dip Acceptance Criteria

Posted by Antonio Rodríguez Arenas
On December 20, 2019
0

Hot Solder Dip Acceptance Criteria for Flat Pack Packages. Different standards can be considered to determine the acceptance of the Hot Solder Dip activity on EEE components

EEE Components, INSPECTION, ELECTRICAL & VERIFICATION, PASSIVES, PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Failure Analysis of Capacitors and Inductors

Posted by Kemet Electronic Corporation
On December 17, 2019
0

General construction of Tantalum, Aluminum electrolytic, Multi-layer Ceramics, Film, and Super capacitors and Common Mode Choke and Surface Mount inductors are explained.

INSPECTION, ELECTRICAL & VERIFICATION, PHYSICAL, MECHANICAL & ASSEMBLY, SPECIFICATIONS / QPLs, TESTING

Updates of ESCC 21001: Destructive Physical Analysis (DPA) of EEE Components

Posted by José Francisco Largaespada
On October 7, 2019
0

What are the typical set of tests included as part of Destructive Physical Analysis (DPA) of EEE Components?

INSPECTION, ELECTRICAL & VERIFICATION, SPECIFICATIONS / QPLs, TESTING

Main changes in ECSS-Q-ST-60-14C, EEE Components Relifing procedure

Posted by Daniel Cruz Fuentes
On October 1, 2019
0

Once the EEE parts have successfully passed the required test and controls, can be considered the parts as “Space Qualified” forever?

ACTIVES, EEE Components, SPECIFICATIONS / QPLs

Review of main changes in generic specification MIL-PRF-55310 REV. F

Posted by José Francisco Largaespada
On July 19, 2019
0

Space standards (such as ESCC and MIL standards) have helped throughout the years to develop the industry and to achieve de mission goals. Standards improve the competitiveness, efficiency and knowledge transfer within space business. However, standards are not frozen documents, but rather they must change and adapt to the current requirements of the industry and the new developments and knowledge gathered during all the years of space missions.

PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Soldering Verification of EEE parts SMD and PCBs

Posted by Mari Carmen López
On May 16, 2019
0

High reliability assembled PCB prototypes as well as novel surface mounted devices (SMD) and mixed systems must be assessed according to well defined qualification test plans. Such high reliability verification programmes are not limited to just evaluate the robustness, reliability and performance of the product but they also address the verification of tools, fabrication procedures and involved materials, as well as the confirmation of product integrity. For instance, ECSS (European Cooperation for Space Standardization” (ECSS) standards used in space programs

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