EEE Components, INSPECTION, ELECTRICAL & VERIFICATION, PASSIVES, PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Failure Analysis of Capacitors and Inductors

Posted by Kemet Electronic Corporation
On December 17, 2019
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General construction of Tantalum, Aluminum electrolytic, Multi-layer Ceramics, Film, and Super capacitors and Common Mode Choke and Surface Mount inductors are explained.

C-SAM - Short Technical Notes, EEE Components, PASSIVES, TESTING

Non-destructive detection of micrometric internal features within EEE microelectronic systems.

Posted by Francisco Javier Aparicio Rebollo
On September 3, 2019
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Micrometric-wide internal features of sub-micrometric thickness can be easily detected in our recently upgraded instrument. The high lateral resolution is within the current state of the start in the non-destructive inspection of deeply embedded objects.

C-SAM - Short Technical Notes, EEE Components, PASSIVES, TESTING

Acoustic Inspection of Hybrid Systems on Laminated Substrates

Posted by Francisco Javier Aparicio Rebollo
On September 3, 2019
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BGA device assembled to a PCB has been submitted to the ECSS verification programme following the guideline defined in the ECSS standard ECSS-Q-ST-70-38C. Metallographic analysis allows us to check the status of such devices after performing the environmental tests (Vibration & Thermal Cycling).

C-SAM - Short Technical Notes, INSPECTION, ELECTRICAL & VERIFICATION, TESTING

Water ingress through delaminated parts in plastic encapsulated systems

Posted by Francisco Javier Aparicio Rebollo
On July 25, 2019
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High-current low dropout regulator encapsulated in a TO-263 package is inspected by scanning acoustic microscopy. Probe frequency and inspection procedure is adapted to system characteristics. In this case the architecture of the system includes features at different depths within a thick package.

C-SAM - Short Technical Notes, INSPECTION, ELECTRICAL & VERIFICATION, TESTING

Doing a Confocal Acoustic Inspection on Optoelectronic Components

Posted by Francisco Javier Aparicio Rebollo
On July 3, 2019
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An Infra-red led emitter is inspected by scanning acoustic microscopy. Probe frequency is adapted to the characteristics of the system. In this case, considering the large thickness of the package a 50 MHz transducer is used. Our phase inversion algorithm identifies and highlights the delaminated areas. In addition, A-scan inspection is used to confirm these findings.

C-SAM - Short Technical Notes, INSPECTION, ELECTRICAL & VERIFICATION, Plastic Packaging for Space, TESTING

Inspection of thick EEE plastic encapsulated parts – CSAM Services

Posted by Francisco Javier Aparicio Rebollo
On June 27, 2019
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High-resolution inspection of plastic encapsulated systems with complex internal architectures requires of confocal imaging techniques to block out-of-focus features that otherwise impair the resolution and the image quality.

INSPECTION, ELECTRICAL & VERIFICATION, TESTING

Alter Technology SAM Testing Capabilities

Posted by Francisco Javier Aparicio Rebollo
On June 17, 2019
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Scanning Acoustic Microscopy Service A-scan, B-scan, C-scan, and Through-scan Circuit, non-circuit, and through-transmitted signal are systematically inspected at different focal depths Delamination (phase inversions) is confirmed by A-scan mode

EEE Components, PASSIVES

MLCC cracking issues in low voltage is report & evaluates by NASA

Posted by Tomáš Zedníček
On May 15, 2019
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Report prepared by Alexander Teverovsky, ASRC Federal Space and Defense. NASA recently released an extensive 70pages report on low voltage MLCC cracking issues published on nepp.nasa.gov. The report in detail describes the manufacturing process of MLCC types, provide comparative analyses of MIL, NASA vs ESA vs JAXA specifications, explains qualification procedures and cracking risk issues including degradation and failure mechanisms. The final section recommends methods for workmanship and failure detection.

INSPECTION, ELECTRICAL & VERIFICATION, TESTING

Working process of C-SAM in EEE Parts

Posted by Francisco Javier Aparicio Rebollo
On March 28, 2019
0

Scanning Acoustic Microscopy (C-SAM) for the non-destructive internal inspection of Microelectronic Parts: How it Works and Physics Fundamentals.

INSPECTION, ELECTRICAL & VERIFICATION, TESTING

Alter Technology SAM Internal procedure

Posted by Francisco Javier Aparicio Rebollo
On January 22, 2019
0

Some specific user requirements cannot be fulfilled by QPL parts (scientific missions). In these situations, plastic encapsulated COTSs are investigated. We comply with the applicable specification so that in this case they comply with the applicable specification. If the plastic encapsulated COTS with the required functionality does not meet the rejection criteria of conventional test methods, Alter Technology, with internal criteria for the assessment of plastic encapsulated COTSs, and the final user agree on a set of new rejection criteria for lot acceptance by considering the actual working conditions plus additional validation test flow based on the expected use.

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Tag: EEE PARTS DELAMINATION