INSPECTION, ELECTRICAL & VERIFICATION, PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

What is Decapsulation of packaged devices?

Posted by Francisco Javier Aparicio Rebollo
On December 20, 2020
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Decapsulation of packaged devices exposes the internal elements of the device under test. Opening devices by this method allows the inspection of the die, interconnects and other features typically examined during failure analysis (FA), constructional analysis (CA) and destructive physical analysis (DPA).

ACTIVES, EEE Components

Quality/reliability issues and detection on High Reliability Optocouplers

Posted by Pedro CARABIAS LÓPEZ
On April 29, 2020
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In this post are depicted some non-destructive technics to detect a potential quality/reliability issue on a EEE component and some others destructive to confirm and asses the preliminary findings

ALTER Innovation, ENDURANCE, ENVIRONMENTAL & RADIATION, TESTING

Dedicated irradiators and facilities for material studies

Posted by doEEEt Media Group
On February 13, 2020
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Space is a harsh environment due to vacuum, UV, temperature, vibration and radiation…etc. Before landing a space vehicle, devices and materials have to be tested at ground level in order to estimate the effect of all these parameters to know about irradiators.