INSPECTION, ELECTRICAL & VERIFICATION, TESTING

Material Analysis Techniques for Electronic Components

Posted by Francisco Javier Aparicio Rebollo
On May 6, 2022
0

Material Analysis is performed to detect and identify the materials used in the manufacturing of semiconductors and microelectronic parts and packages. One particular use of this analysis is the detection of prohibited materials, especially in the lead finish, to identify potential reliability issues such as undesirable whisker growth caused by pure tin finishes. Lead finish validation for every component type to be soldered is essencial to determine the correct soldering profile.

PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Resistance To Solvent the Importance marking testing on EEE Parts

Posted by Jesús Enrique Barbero Muñoz
On March 28, 2021
0

The purpose of this test is to verify that the markings on component parts will not become illegible when subjected to solvents (e.g. during the board cleaning process after parts assembly) or during normal handling, and that the solvents employed for the test will not cause deleterious, mechanical or electrical damage or deterioration of the materials or finishes. The applicable test standards are MIL-STD-750 method 1022, MIL-STD-883 method 2015, or ESCC 24800, among others, depending on the part type.

EEE Components, PASSIVES

A Novel Non-Destructive Inspection Technique to Detect Counterfeit Electronic Components

Posted by doEEEt Media Group
On October 21, 2020
0

Unverified or counterfeited electronic components pose a big threat globally because they could lead to malfunction of safety-critical systems and reduced reliability of high-hazard assets. Researchers at Cranfield University in the UK propose a new fast non-destructive method of electronic components inspection using pulsed thermography.

INSPECTION, ELECTRICAL & VERIFICATION, TESTING

Radiographic Inspection 3D X-Ray – 2D

Posted by José Cándido Vázquez Cárdeno
On September 14, 2020
0

The purpose of radiographic inspection is to detect internal physical defects which are not otherwise visible in electronic components. The radiographic techniques reveal such flaws as the presence of foreign objects, improper interconnecting wires, inhomogeneities in materials, improper positioning of elements, voids in the die attach material or encapsulating, etc.

EEE Components, INSPECTION, ELECTRICAL & VERIFICATION

Idiosyncrasy of International Space Markets

Posted by Jose Luis Alvarez de Cienfuegos Gálvez
On August 30, 2020
0

IDIOSYNCRASY OF INTERNATIONAL SPACE MARKETS Six decades have passed since the launch of the first artificial satellite by the USSR (Sputnik) and five decades since the landing of human beings on the Moon (Apollo project -USA-), two of the greatest landmarks of the space race that began in the shadow of the “Cold War” between the US and the USSR. After the conquest of the new world in the 16th century, this is considered a new turning point in the history of humanity that leads some authors to claim it as the beginning of a new period of history: The Space Age.

INSPECTION, ELECTRICAL & VERIFICATION, PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

MIL-STD-883 METHOD 2003 – Solderability Testing

Posted by Manuel Padial Pérez
On July 23, 2020
0

The Mil-Std-883 Method 2003 Is One Of The Oldest And Most Widely Used Standards For Solderability Testing.

ALTER Laboratory Services

Solderability Test

Posted by Manuel Padial Pérez
On March 28, 2020
0

Solderability test refers to the process of evaluating the solderability of terminations (i.e., component leads, lugs, terminals, wires, etc.). which are normally joined by a soldering operation. The solderability determination is based on the ability of the terminations to be wetted by the molten solder after accelerated aging.

ENDURANCE, ENVIRONMENTAL & RADIATION, INSPECTION, ELECTRICAL & VERIFICATION, TESTING

Video Digging into Circuit Alter Technology

Posted by doEEEt Media Group
On June 17, 2019
0

For satellite applications where failure is not an option, electronic components need to operate constantly on demand, and have to be free of failures during the lifetime of the satellite-which can be for many years. To ensure this requirement is met, the components are put through many hours of stress testing covering all thermal.

INSPECTION, ELECTRICAL & VERIFICATION, TESTING

XPS, how it works and its applications in EEE parts

Posted by Francisco Javier Aparicio Rebollo
On May 30, 2019
0

X-ray photoemission spectroscopy (XPS) also known as electron spectroscopy for chemical analysis (ESCA) is a surface-sensitive quantitative analysis method to accurately determine the elemental composition of solid materials. The technique is the most extended tool for the chemical characterization of thin films coatings and surfaces either for industrial applications as well as for research

INSPECTION, ELECTRICAL & VERIFICATION, TESTING

XRF tool, how it works and its applications in EEE parts

Posted by Francisco Javier Aparicio Rebollo
On May 16, 2019
0

XRF is a non-destructive and quick analytical tool to determine the chemical elements present in the specimen. In particular, it combines low detection limit (particularly in the case of heavy elements) with quick and easy sample preparation.