INSPECTION, ELECTRICAL & VERIFICATION, TESTING

What is a C-SAM Inspection?

Posted by Francisco Javier Aparicio Rebollo
On January 29, 2022
0

Internal (invisible) fabrication and materials defects can critically compromise the performance of encapsulated microelectronics parts. Similarly, accidental constructional failures (missing parts) and counterfeit suppose and non-negligible issue in the current EEE market.

INSPECTION, ELECTRICAL & VERIFICATION, TESTING

Scanning Microscopy Equipment our new adquisition

Posted by Francisco Javier Aparicio Rebollo
On December 13, 2021
0

ALTER TECHNOLGY upgrades its Scanning Acoustic Microscopy capabilities. Alter Technology has upgraded its Scanning Acoustic Microscopy capabilities by acquiring a new FineSAT V acoustic microscope from Hitachi. FineSAT V, the high-end model of the FineSAT series, combines advanced inspection features with the faster inspection speed currently available in the market.

INSPECTION, ELECTRICAL & VERIFICATION, TESTING

Industry Applications where C-SAM is used

Posted by Francisco Javier Aparicio Rebollo
On November 29, 2021
0

C-SAM is a reliable and powerful tool for the non-destructive testing of microelectronic parts and base materials. Moreover, it is mandatory for different applications such as those described below for different sectors. In order to provide a fast reply to our customer needs our Virtual Lab platform for Remote Testing grants immediate access to our test results and fast communication with our engineers during and after the test.

ALTER Laboratory Services, INSPECTION, ELECTRICAL & VERIFICATION, Plastic Packaging for Space

Are there Voids in your IC Plastic Molding?

Posted by Raquel Cano Cordero
On November 10, 2021
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Voids are defined as a lack of material within the bulk of the moulding compound and are common in ICs since they appear during improper molding manufacturing (injection, extrusion, etc.) and curation.

ACTIVES, C-SAM - Short Technical Notes, EEE Components, TESTING

Thermo-mechanical Analyser – TMA – capabilities

Posted by Raquel Cano Cordero
On October 5, 2021
0

The thermomechanical analysis (TMA) of plastic encapsulated microelectronic and COTS parts is a fundamental technique to avoid (during the design and fabrication stage) and foresee anomalies related to the deformation of packages with temperature. Thus, this is a very effective tool to disclose and screen out possible reliability concerns related to the thermo-mechanical integrity and stability of the devices.

ACTIVES, EEE Components

Electronic components for motor vehicles: the solution in New Space?

Posted by Demetrio López
On September 16, 2021
0

There are well-known advantages to using these photonic technologies in space, such as the limited generation of noise, electromagnetic immunity,

ALTER Laboratory Services, INSPECTION, ELECTRICAL & VERIFICATION, TESTING

Thermo-Mechanical Analysis

Posted by Raquel Cano Cordero
On August 9, 2021
0

The thermomechanical analysis (TMA) of plastic encapsulated microelectronic, and COTS parts is a fundamental technique to avoid (during the design and fabrication stage) and foresee anomalies related to the deformation of packages with temperature. Thus, this is a very effective tool to disclose and screen out possible reliability concerns related to the thermo-mechanical integrity and stability of the devices.

ALTER Laboratory Services, INSPECTION, ELECTRICAL & VERIFICATION

Importance of the SAM for delamination detection

Posted by Raquel Cano Cordero
On July 13, 2021
0

SAM for delamination detection. Scanning Acoustic Microscopy is a technique that has revealed as the most effective and complete non-destructive approach for the detection of critical and latent anomalies within plastic encapsulated parts

INSPECTION, ELECTRICAL & VERIFICATION, TESTING

Radiographic X-Ray Inspection

Posted by doEEEt Media Group
On July 2, 2021
0

The purpose of a Radiographic Inspection is to nondestructively detect defects that are not otherwise visible: improper positioning of parts, broken elements, inhomogeneities in materials, foreign objects…

Small Sats Testing

Component Testing for New Space Applications

Posted by Enrique Cordero
On July 2, 2021
0

This standard describes the differences and the minimum testing requirements necessary to each of these three classes for evaluation, screening, and lot acceptance. The following test sequence shows the evaluation test sequence for class 1 components, this sequence is the same in the three classes described in the standard with different severity and test conditions to each class.

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