C-SAM Ultrasonic Analysis to Identify High Voltage MLCC Defects

Posted by doEEEt Media Group
On October 19, 2023
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This article has examined anomalies within one high-voltage MLCC, and at their specific depths. These anomalies, even if minuscule, are capable of causing instantaneous failure of the high-voltage MLCC and impairment or failure of the system they are part of. But the solid-to-air interface of these anomalies reflects virtually 100 percent of an ultrasonic pulse and makes them highly visible.

EEE Components, PASSIVES

Failure Analysis of Capacitors and Inductors

Posted by doEEEt Media Group
On October 19, 2023
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The goal of passive components’ failure analysis (FA) is to determine the root cause for an electrical failure. The findings can be used by the manufacturers to improve upon the design, materials, and processes used to create their components. This leads to better quality and higher reliability components. The FA also provides feedback for the users to improve their handling, storage, and applications of these components.

ENGINEERING AND PROJECT MANAGEMENT SUPPORT

Pre-Procurement

Posted by Susana Galdeano
On May 3, 2022
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The pre-procurement phase combines the EEE parts state-of-the-art analysis, risk analysis and component ownership cost optimization with regards to the mission requirements, design criticality and budget. In order to achieve this, the project manager leading a multidisciplinary team must find the optimal balance between component information availability (traceability, materials, testing, previous use…) and minimum tests to perform, reaching an acceptable level of reliability covering the technical, schedule and costing constraints.

INSPECTION, ELECTRICAL & VERIFICATION

Constructional Analysis Tests

Posted by doEEEt Media Group
On April 26, 2022
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Constructional Analysis as a complete service provides a deep understanding of the technologies used during the manufacturing process, information about the construction of their device

INSPECTION, ELECTRICAL & VERIFICATION

Scanning Acoustic Microscopy (SAM) and X-Ray Tomography

Posted by doEEEt Media Group
On April 26, 2022
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The Scanning Acoustic Microscopy (SAM) technique is the most effective and complete non-destructive approach for the detection of critical and latent anomalies within plastic encapsulated parts, either on assembled or non-assembled systems

COTS components

COTS in space: Does delamination really cause critical failures?

Posted by Emilio Cano García
On April 20, 2022
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One of the biggest cons of COTS is the plastic package. Plastic can cause outgassing, coating nearby components in chemicals that cause corrosion. Besides, the non-hermetic sealing can also allow humidity into packages, ultimately leading to corrosion of the semiconductor inside.

New Space Microelectronics

Advantages of SAM for new space microelectronics inspection

Posted by Javier Alejandro de la Ossa Fernández
On March 10, 2022
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SAM provides non-destructive imaging of defects and delamination in die and package materials. It is widely used to inspect microelectronics parts such as plastic encapsulated ICs, flip-chip systems, bonded wafers, printed circuit boards (PCBs), etc. It is particularly useful for the inspection of small and complex devices. SAM is highly sensitive to defects that commonly originate under different stresses during manufacturing.

ALTER Laboratory Services, INSPECTION, ELECTRICAL & VERIFICATION

Frequently Asked Questions (FAQs) – Scanning Acoustic Microscopy

Posted by doEEEt Media Group
On February 23, 2022
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Over the years, our experience in CSAM testing has allowed us, among other things, to have conversations with clients who have come to us with questions about our laboratory services. In ALTER, we are an expert and reliable supplier in the engineering and testing EEE components and equipment for space and other technology markets. This article reports the importance of X-Ray Tomography, Scanning Acoustic Microscopy (SAM), and Cross Section techniques, and the advantages of their combined use for accurate testing.

INSPECTION, ELECTRICAL & VERIFICATION, TESTING

SAM: Survey to manufacturers and users

Posted by Francisco Javier Aparicio Rebollo
On February 17, 2022
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Do you perform/consider the initial qualification and/or periodic production validation with C-SAM (or other SAM tests)? What acceptance or reject criteria do you use for C-SAM (or other SAM tests)?

ALTER Laboratory Services, Plastic Packaging for Space

Test combination for detecting defects in plastic ICs

Posted by doEEEt Media Group
On February 10, 2022
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Importance Of Combining X-Ray Tomography, Scanning Acoustic Microscopy (SAM), And Cross Section Techniques For Electronic Components Inspections This article reports the importance of X-Ray Tomography, Scanning Acoustic Microscopy (SAM), and Cross Section techniques, and the advantages of their combined use for accurate testing.

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