INSPECTION, ELECTRICAL & VERIFICATION, TESTING

What is SEM EDS as Internal Material Analysis?

Posted by Francisco Javier Aparicio Rebollo
On May 2, 2019
0

This analytic technique may provide both qualitative and quantitative information of the composition of a surface, i.e. identification of the elements and the element weights, respectively. The technique relies on the detection and spectroscopy of secondary radiation (X-Ray) emitted when a high-intensity incident beam of electrons impinges upon the materials placed in its path. The SEM – EDS Internal Material Analysis (also known as EDX or EDAX) can be performed in accordance with MIL-STD-883, MIL-STD-750, MIL-STD-1580 and ESCC 25500 requirements.

INSPECTION, ELECTRICAL & VERIFICATION, TESTING

Identifying Leakage Pathway with a Penetrant Dye Gross Leak Test

Posted by David Ramirez - Cruzado
On March 13, 2019
0

Penetrant dye gross leak test is used to identify leakage pathways within hermetic and non-hermetic devices, such as glass body devices or plastic encapsulated parts. The test provides a definitive view of the leak paths including cracks, voids, delaminations and other fractures.

PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

DPA parts examination used for Electrical Components

Posted by doEEEt Media Group
On February 20, 2019
0

Destructive Physical Analysis DPA is a systematic, logical, detailed examination of EEE parts at various stages of physical disassembly. This activity is performed in order to verify that the manufactured lot quality is in accordance with the detailed specification and project requirements.

PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

DC power – Use of Substrate Attach Strength – Die Shear Strength Method

Posted by José Cándido Vázquez Cárdeno
On February 13, 2019
0

The purpose of the test is to determine the strength of the element attachment system when subjected to force in the Y1 axis, and thus to determine the integrity of materials and processes used to attach semiconductor die or surface mounted elements to package headers or other substrates. The implementation of this test includes material evaluation and process control.

PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Test Methods in Electronic parts. The Vibration Tests

Posted by María Teresa Rodríguez
On February 13, 2019
2

The purpose of vibration tests is to evaluate the effect caused on component parts by vibration in a specified frequency range. The samples are subjected to testing under different conditions, as described below, in accordance with the respective applicable standards. The test conditions differ in terms of duration, frequency range, vibration waveform, amplitude, etc.

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