PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Bond Pull Test

Posted by Jesús Enrique Barbero Muñoz
On October 14, 2020
0

The purpose of Bond Pull Test is to measure bond strengths, to evaluate bond strength distributions and to determine compliance with specified bond strength requirements of the applicable acquisition document in order to ensure the proper manufacturing process and long-term reliability of the bonds under stress conditions, such as vibration, shock, thermal cycling or wearout phenomena.

ALTER Projects, ENDURANCE, ENVIRONMENTAL & RADIATION, INSPECTION, ELECTRICAL & VERIFICATION, PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

SENTINEL 3A

Posted by doEEEt Media Group
On October 14, 2020
0

The Sentinels are a fleet of satellites designed to deliver the wealth of data and imagery that are central to the European Commission’s Copernicus programme.

EEE Components, ENGINEERING AND PROJECT MANAGEMENT SUPPORT

What is a Parts Procurement Control Parts (PPCP)?

Posted by Manuel Sánchez Ruiz
On September 28, 2020
0

PPCP defines the technical provisions and all the associated procedures for EEE parts, including all the engineering and quality assurance aspects. This allows to establish an homogeneity regarding parts quality and dependability during all project procurement phase.

EEE Components, ENGINEERING AND PROJECT MANAGEMENT SUPPORT

PRODUCT ASSURANCE (PA) Support: What is and why it is important

Posted by Manuel Sánchez Ruiz
On September 28, 2020
0

Product Assurance (PA) stands as a fundamental pillar. Product Assurance can be defined as the set of requirements that materials, processes and parts must comply to assure proper performance of the equipment during the mission lifetime. These rules are gathered in a PA Plan.

INSPECTION, ELECTRICAL & VERIFICATION, TESTING

Radiographic Inspection 3D X-Ray – 2D

Posted by José Cándido Vázquez Cárdeno
On September 14, 2020
0

The purpose of radiographic inspection is to detect internal physical defects which are not otherwise visible in electronic components. The radiographic techniques reveal such flaws as the presence of foreign objects, improper interconnecting wires, inhomogeneities in materials, improper positioning of elements, voids in the die attach material or encapsulating, etc.

Microsectioning - Short Technical Notes, PASSIVES, PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Plating Thickness Testing Overview in Alter Technology Lab.

Posted by Mari Carmen López
On July 28, 2020
0

Cross-sectioned ceramic capacitors were metallographically prepared in the Materials & Processes Laboratory, recognized as a recommended facility for such activity by the ESA authority (MEMO ESA-TECMSP-MO-013165).

INSPECTION, ELECTRICAL & VERIFICATION, PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

MIL-STD-883 METHOD 2003 – Solderability Testing

Posted by Manuel Padial Pérez
On July 23, 2020
0

The Mil-Std-883 Method 2003 Is One Of The Oldest And Most Widely Used Standards For Solderability Testing.

EEE Components, MANUFACTURER NOTIFICATION, PASSIVES

Glass Encapsulated Beads ESCC 4006/014 Type NTC Thermistors

Posted by Manuel Padial Pérez
On July 12, 2020
0

In this post are addressed two product change notifications (PCN) affecting to 4006/014 type variants. Changes which have been discussed and agreed with ESA without any effect on the qualification status of ESCC qualified devices

INSPECTION, ELECTRICAL & VERIFICATION, TESTING

What is an External Visual Inspection?

Posted by David Ramirez - Cruzado
On May 21, 2020
0

Consists of a non-destructive optical inspection. Binoculars with magnification between 1x and 60x and with a relatively large and accessible field of view are employed for this purpose. The aim of this process is to verify the conformity of the exterior of electrical, electronic and electromechanical components (EEE parts) with the acquisition document.

EEE Components, Microsectioning - Short Technical Notes, PASSIVES, PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Microsectioning inspection of assembled capacitors

Posted by Mari Carmen López
On May 9, 2020
0

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