INSPECTION, ELECTRICAL & VERIFICATION, TESTING

Verifying the Structural Quality of the Glassivation Layer

Posted by Francisco Javier Aparicio Rebollo
On February 21, 2021
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This test is performed to verify the structural quality of the glassivation layer in aluminum metalized semiconductor devices or microcircuits. The glassivation layer is a deposited dielectric film (e.g., CVD, sputtered of electron beam evaporated glass or nitride, etc.) and its good condition is essential to avoid such problems as electromigration.

INSPECTION, ELECTRICAL & VERIFICATION, TESTING

When to use the Focused Ion Beam (FIB) Micro-Sectioning technique

Posted by Francisco Javier Aparicio Rebollo
On February 21, 2021
0

Focused ion beam, also known as ion milling, is a technique used particularly in the semiconductor industry and materials science for site-specific analysis, deposition and ablation of materials

ALTER Laboratory Services, Alter Technology Products, INSPECTION, ELECTRICAL & VERIFICATION, TESTING

Virtual Vibration Laboratory

Posted by María Teresa Rodríguez
On February 8, 2021
0

Alter Technology developed an online platform where the customer can design its own test solution specifically adapted to the actual needs and requirements and monitor the result in real-time, without the need to wait to complete all the activities.

ALTER Laboratory Services, INSPECTION, ELECTRICAL & VERIFICATION, TESTING

Vibration Services & Acreditations

Posted by María Teresa Rodríguez
On February 8, 2021
0

Vibration Testing is a very specialized field where Alter Technology is a highly qualified laboratory performing numerous tests in EEE Parts. To do all this kind our services that our expert brings to you, we have extended and qualified accreditations that bring to your needs a secure and safe work.

ALTER Laboratory Services, INSPECTION, ELECTRICAL & VERIFICATION, TESTING

Vibration Laboratory Equipment

Posted by María Teresa Rodríguez
On February 8, 2021
0

At Alter Technology we offer a full Laboratory Equipment for any needs in differents type and shapes of the Hi-Rel Components with an expert group that will support you in all the process.

ENGINEERING AND PROJECT MANAGEMENT SUPPORT

Post Procurement and Components Control/Validation

Posted by Susana Galdeano
On February 3, 2021
0

Once the pre-procurement and procurement activities have been considered, the project manager and the different team members will ensure that the whole process to validate commercial components is performed accordingly in a timely manner.

INSPECTION, ELECTRICAL & VERIFICATION, TESTING

Scanning Electron Microscope – SEM/FIM – Inspections

Posted by Francisco Javier Aparicio Rebollo
On December 14, 2020
0

SEM available high magnification tool to analyze the design, construction or handling defects. It can be used to check the interconnect metallization on an integrated circuit: metal step coverage, etc., or for performing an in-depth technology study: reverse engineering, die cross sectioning, failure analysis, etc.

INSPECTION, ELECTRICAL & VERIFICATION, PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Looking at Device Internal Structure by a Cross sectioning of EEE Parts

Posted by Francisco Javier Aparicio Rebollo
On November 27, 2020
0

The cross-sectioning process provides access to the device internal structure, its materials and design. Such components as diodes and capacitors and silicon dice are often subjected to cross-sectioning to detect the defects which could not be found using other testing techniques.

INSPECTION, ELECTRICAL & VERIFICATION, TESTING

Dimensions and Weight check of EEE Parts, What is the Purpose of it?

Posted by Emilio Cano García
On November 21, 2020
0

Dimensions and weight check are operations necessary to compare the actual dimensions and weight to those stated in the specifications. The purpose of the inspection is to detect: Manufacturer deviations Handling damages that could affect the device assembly and its final application

INSPECTION, ELECTRICAL & VERIFICATION, TESTING

Internal Visual Inspection of Hi-Rel EEE Parts

Posted by David Ramirez - Cruzado
On November 6, 2020
0

The aim of this destructive test is to demonstrate that the internal materials, design, construction, and assembly of EEE parts are in accordance with the applicable acquisition document. This test can also be performed to examine unsealed devices prior to capping to verify that no damage and/or defects have appeared as a result of prior testing (see Pre-cap Inspection).

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