Reliability analysis of plastic encapsulated active components exhibiting interfacial delamination in CSAM

Posted by doEEEt Media Group
On August 1, 2023
0

EEE plastic encapsulated devices are gaining wide acceptance due to their advantages in size, weight, cost, availability performance are state-of-the-art. However, long-term reliability is influenced by its inherent structures and materials

ACCEDE 2022, EEE Components, PASSIVES

New Techniques for COTS assembly verification

Posted by doEEEt Media Group
On August 1, 2023
0

New Space requires a new point of view in the way of doing things in many aspects. One of these aspects is the assembly verification process. A change from testing to assembly verification models is needed to reduce the time and cope with the COTS packages.