The ‘relativity’ of High Q capacitors

Posted by doEEEt Media Group
On June 3, 2020
0

For many high power RF applications, the ‘Q factor’ of embedded capacitors is one of the most important characteristics in the design of circuits. This includes products such as cellular/telecom equipment, MRI coils, plasma generators, lasers and other medical, military and industrial electronics.

EEE Components, PASSIVES

Induction Heating and Induction Heating Capacitors

Posted by Tomáš Zedníček
On May 30, 2020
0

Induction heating occurs when an electrically conducting material is placed within a varying magnetic field. The heating is due to eddy-current losses within the material (in magnetic materials such as iron, some heat is also generated by hysteresis losses). Let’s have a look at needs for capacitors in this application field.

EEE Components, PASSIVES

X8G, X8L and X8R ceramic capacitor dielectrics

Posted by doEEEt Media Group
On May 29, 2020
0

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EEE Components, PASSIVES

Best Ceramic Technologies for High Power Density Applications?

Posted by Kemet Electronic Corporation
On May 14, 2020
0

Capacitors are increasingly being recognized for having the potential to improve efficiency and power density. Read about ceramic technology guidelines for high power density circuits.

EEE Components, PASSIVES

Capacitors Can Help With ESD Too

Posted by doEEEt Media Group
On May 14, 2020
0

The data speed of the signals, traces, and ICs to be protected are something that must be carefully considered. In general, the faster the signal the less cap that can be safely placed on it.

EEE Components, Microsectioning - Short Technical Notes, PASSIVES, PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Microsectioning inspection of assembled capacitors

Posted by Mari Carmen López
On May 9, 2020
0

Cross-sectioned ceramic capacitors were metallographically prepared in the Materials & Processes Laboratory, recognized as a recommended facility for such activity by the ESA authority (MEMO ESA-TECMSP-MO-013165).

PASSIVES

Discoidal MLCC and planar arrays to suppress EMI

Posted by doEEEt Media Group
On May 4, 2020
0

The performance of an electronic system can be significantly degraded by electromagnetic disturbances. This type of performance degradation is referred to as electromagnetic interference (EMI).

EEE Components, PASSIVES

Capacitor Technology: 2019-2025 What’s Next

Posted by doEEEt Media Group
On April 17, 2020
0

In the technical-economics of capacitance, the greatest ROI in research dollars comes from the manipulation of the available surface area of the traditional dielectric materials: Ceramic, Plastic, Aluminum, and Tantalum.

EEE Components, PASSIVES

Capacitance Package, Minimizing Footprint while Maximizing

Posted by Kemet Electronic Corporation
On April 17, 2020
0

KEMET KONNEKT™ package allows two to four ceramic capacitors to be stacked vertically or horizontally while retaining the integrity of the part. It uses transient liquid phase sintering (TLPS) technology to bond component terminations together. The KONNEKT™ U2J capacitors can be used in both orientations, thus minimizing the component footprint, while maximizing the bulk capacitance of a stacked MLCC with design flexibility in mind.

EEE Components, PASSIVES

2020 May be a Messy Year for MLCCs Supply

Posted by doEEEt Media Group
On March 24, 2020
0

Capacitor manufacturers have been adding capacity since 2017 and, while lead times for many parts could stretch, allocations for most parts, are not likely. However, it is unclear what the MLCC scenario will be and if buying conditions will turn from being a buyer’s market to a seller’s market. One thing is for sure. The MLCC market will be different in 2020 than it was in 2019.

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