HEATPACK: Higher thermal dissipation in space systems

Posted by Juan Moreno Echarri
On June 29, 2021
0

HEATPACK (High thErmAl efficiency componenTs PACKages for space) is the European effort to develop the next generation of low thermal resistance packages, in particular thanks to the implementation of state-of-the-art diamond-based composite materials and disruptive new heat sink solutions.

PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Why Microsectioning sample preparation of PCB systems?

Posted by Mari Carmen López
On May 19, 2021
0

Microsectioning sample preparation is an essential tool for the detailed materialographic inspection of EEE parts, including solder joints on PCB systems involving both surface mounting technology (SMT) and through hole technology (THT). In reveals critical information regarding the structural characteristics and the workmanship quality that is not accessible by other techniques.

ACTIVES, EEE Components

Typical Parameters in the Electrical Test of Operational Amplifiers

Posted by Sonia Vargas
On December 28, 2020
0

In order to evaluate the effects of certain stress sources related to space applications, a set of electrical parameters are measured during the process. Here are presented the typically used ones for operational amplifiers.

INSPECTION, ELECTRICAL & VERIFICATION, TESTING

SAM: Test flow and procedures

Posted by Francisco Javier Aparicio Rebollo
On September 17, 2020
0

Nowadays scanning acoustic microscopy (SAM) is extensively used in the non-destructive inspection of microelectronic devices and is present in different space verification programs; particularly for plastic-encapsulated electronic components. This is so due to the ability to image the internal morphology, location, size and distribution of hidden features including different types of flaws.

WEBINAR

FLUX Webinar – QML by Technology Flow Qualification

Posted by doEEEt Media Group
On June 28, 2020
2

In this webinar, you will be able to learn more about the work that the company FLUx has been doing for more than 30 years in the aerospace market and its most recent developments concerning QML.

WEBINAR

WEBINAR: STMicroelectronics Rad-Hard Integrated Current Limiter (ICL)

Posted by doEEEt Media Group
On June 28, 2020
0

The webinar describes circuit-level details of how to use the device in the intended applications and presents some experimental results demonstrating its performance. The RHRPMICL1A device has been recently qualified to the QML-V standard for radiation hardness with SMD number 5962-17211