Plastic Encapsulation of Semiconductors in the UK

The European and UK semiconductor industry has been demanding a low-cost plastic package solution for medium volumes.  High volume lines for outsourced assembly and test (OSAT), mostly based in Asia, are dominated by consumer, mobile and automotive applications.

Although assembly of initial prototypes and small quantities into cavity packages can be provided in Europe, this is only cost-effective for 10’s units.  Users with low to medium applications such as space, medical, industrial, and aerospace are struggling to find reasonably priced assembly. They are never likely to reach volumes that are attractive to high-volume OSATs.  Small batches requiring numerous set-ups and stop-start of production lines make factories very inefficient in an age where efficiency is critical to their survival and cost structure.

Some users also have compelling technical reasons why even prototypes should be in an over-molded package and that it should be synonymous with production, such as RF, high voltage and thermal characteristics.

In parallel, the European space community is rapidly adopting commercial-off-the-shelf (COTS) components in plastic packages for use in low earth orbit and constellation applications to reduce cost, size and weight.  The use of COTS limits component selection to OEM line cards, and there is little or no provision for customised components or emerging technologies (ASICs, MEMS, sensors, compound semiconductors, etc.) at a low price point.  Also, traditional quality requirements such as traceability, inspections, and testing are not serviced by COTS providers.

QFN and BGA dominate the semiconductor market with >50% market share; these packages are flexible platforms which can be serviced with common block mold tooling and saw singulation.  Soldering techniques and PCB materials are being adapted to cope with leadless packages, even for robust applications such as space and defence.

Alter Technology UK have announced the introduction of a plastic QFN assembly line for batch sizes from 100pcs to several thousand, with a total capacity in the millions per year.  The announcement signifies a unique capability in the UK, and Alter is one of a handful of facilities in Europe with such capability.

Matt Booker, Alter Technology UK