ALTER Laboratory Services, Plastic Packaging for Space

Test combination for detecting defects in plastic ICs

Posted by doEEEt Media Group
On February 10, 2022
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Importance Of Combining X-Ray Tomography, Scanning Acoustic Microscopy (SAM), And Cross Section Techniques For Electronic Components Inspections This article reports the importance of X-Ray Tomography, Scanning Acoustic Microscopy (SAM), and Cross Section techniques, and the advantages of their combined use for accurate testing.

ALTER Laboratory Services, INSPECTION, ELECTRICAL & VERIFICATION

Frequently Asked Questions (FAQs) – Scanning Acoustic Microscopy

Posted by doEEEt Media Group
On February 23, 2022
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Over the years, our experience in CSAM testing has allowed us, among other things, to have conversations with clients who have come to us with questions about our laboratory services. In ALTER, we are an expert and reliable supplier in the engineering and testing EEE components and equipment for space and other technology markets. This article reports the importance of X-Ray Tomography, Scanning Acoustic Microscopy (SAM), and Cross Section techniques, and the advantages of their combined use for accurate testing.

ALTER Laboratory Services, INSPECTION, ELECTRICAL & VERIFICATION, TESTING

Thermo-Mechanical Analysis

Posted by Raquel Cano Cordero
On August 9, 2021
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The thermomechanical analysis (TMA) of plastic encapsulated microelectronic, and COTS parts is a fundamental technique to avoid (during the design and fabrication stage) and foresee anomalies related to the deformation of packages with temperature. Thus, this is a very effective tool to disclose and screen out possible reliability concerns related to the thermo-mechanical integrity and stability of the devices.

INSPECTION, ELECTRICAL & VERIFICATION, TESTING

SAM: Survey to manufacturers and users

Posted by Francisco Javier Aparicio Rebollo
On February 17, 2022
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Do you perform/consider the initial qualification and/or periodic production validation with C-SAM (or other SAM tests)? What acceptance or reject criteria do you use for C-SAM (or other SAM tests)?

INSPECTION, ELECTRICAL & VERIFICATION, TESTING

SAM Test methods: comparisons

Posted by Francisco Javier Aparicio Rebollo
On June 17, 2020
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Additional testing: This deviation is considered as a reliability concern and additional tests must be conducted to check the system performance. From the point of view of the SAM inspection, such deviations do not comply with the acceptance criterion

INSPECTION, ELECTRICAL & VERIFICATION, TESTING

Alter Technology SAM Internal procedure

Posted by Francisco Javier Aparicio Rebollo
On January 22, 2019
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Some specific user requirements cannot be fulfilled by QPL parts (scientific missions). In these situations, plastic encapsulated COTSs are investigated. We comply with the applicable specification so that in this case they comply with the applicable specification. If the plastic encapsulated COTS with the required functionality does not meet the rejection criteria of conventional test methods, Alter Technology, with internal criteria for the assessment of plastic encapsulated COTSs, and the final user agree on a set of new rejection criteria for lot acceptance by considering the actual working conditions plus additional validation test flow based on the expected use.

INSPECTION, ELECTRICAL & VERIFICATION, TESTING

Radiographic X-Ray Inspection

Posted by doEEEt Media Group
On July 2, 2021
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The purpose of a Radiographic Inspection is to nondestructively detect defects that are not otherwise visible: improper positioning of parts, broken elements, inhomogeneities in materials, foreign objects…

ACTIVES, C-SAM - Short Technical Notes, EEE Components, TESTING

Thermo-mechanical Analyser – TMA – capabilities

Posted by Raquel Cano Cordero
On October 5, 2021
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The thermomechanical analysis (TMA) of plastic encapsulated microelectronic and COTS parts is a fundamental technique to avoid (during the design and fabrication stage) and foresee anomalies related to the deformation of packages with temperature. Thus, this is a very effective tool to disclose and screen out possible reliability concerns related to the thermo-mechanical integrity and stability of the devices.

INSPECTION, ELECTRICAL & VERIFICATION, TESTING

Industry Applications where C-SAM is used

Posted by Francisco Javier Aparicio Rebollo
On November 29, 2021
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C-SAM is a reliable and powerful tool for the non-destructive testing of microelectronic parts and base materials. Moreover, it is mandatory for different applications such as those described below for different sectors. In order to provide a fast reply to our customer needs our Virtual Lab platform for Remote Testing grants immediate access to our test results and fast communication with our engineers during and after the test.

ACTIVES, EEE Components, SPECIFICATIONS / QPLs

Review of main changes in generic specification MIL-PRF-55310 REV. F

Posted by José Francisco Largaespada
On July 19, 2019
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Space standards (such as ESCC and MIL standards) have helped throughout the years to develop the industry and to achieve de mission goals. Standards improve the competitiveness, efficiency and knowledge transfer within space business. However, standards are not frozen documents, but rather they must change and adapt to the current requirements of the industry and the new developments and knowledge gathered during all the years of space missions.

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