Power factor correction (PFC) capacitors

Posted by doEEEt Media Group
On August 9, 2020
0

The most commonly used types for power factor correction are constructed using a metallized polypropylene film while a few employ metallized polyester film or paper

SiC Testing

SiC Testing and Properties

Posted by doEEEt Media Group
On December 11, 2020
0

Space qualified silicon carbide power diodes developed by CNM-CSIC in collaboration with ALTER TECHNOLOGY will be handled as ALTER TECHNOLOGY specific product for high reliability and harsh environment-related markets.

SiC Testing

SiC Testing: Heavy ions test using SiC power devices

Posted by doEEEt Media Group
On February 19, 2021
0

New failure modes not observed in Silicon appear while testing SiC MOSFET and Schottky diodes and under heavy ions radiation. Gate damage in transistors remains undetected even monitoring drain current and gate leakage of the transistor under high voltage biasing conditions.

INSPECTION, ELECTRICAL & VERIFICATION

Scanning Acoustic Microscopy (SAM) and X-Ray Tomography

Posted by doEEEt Media Group
On April 26, 2022
0

The Scanning Acoustic Microscopy (SAM) technique is the most effective and complete non-destructive approach for the detection of critical and latent anomalies within plastic encapsulated parts, either on assembled or non-assembled systems

ACTIVES, COTS, New Space, LEO Constellations, EEE Components

KEMET: High Reliability Alternative (HRA) SERIES

Posted by Manuel Padial Pérez
On November 25, 2019
0

In addition to the Automotive, MIL-PRF and Space grade series, these are the Kemet proposal to address High Reliability Applications

EEE Components, PASSIVES

Solid and polymer tantalum capacitors vs. SMT MLCCs

Posted by doEEEt Media Group
On June 6, 2020
0

There are two primary capacitor technologies that are most often considered for surface-mount applications: electrostatic and electrolytic. The most common electrostatic types are MLCCs and film capacitors. Due to current bottlenecks in the procurement of surface-mount ceramic capacitors, however, designers are looking for substitutes to keep their production lines running smoothly, and to find long term replacements for hard to find ratings.

COTS, New Space, LEO Constellations

The COTS use in harsh Radiation environment of the CERN accelerators complex

Posted by Ruben Garcia
On November 22, 2019
0

The radiation environment encountered at high-energy accelerators is composed of a mixed field expected made of charged and neutral hadrons (protons, pions, kaons and neutrons), photons, electrons and muons, ranging from very low (thermal) energies up to the TeV range. Electronic components and systems exposed to a mixed radiation field can suffer from Single Event Effects (SEEs), damage from Total Ionizing Dose (TID) and Displacement Damage (DD).

ALTER Innovation, ENDURANCE, ENVIRONMENTAL & RADIATION, TESTING

Dedicated irradiators and facilities for material studies

Posted by doEEEt Media Group
On February 13, 2020
0

Space is a harsh environment due to vacuum, UV, temperature, vibration and radiation…etc. Before landing a space vehicle, devices and materials have to be tested at ground level in order to estimate the effect of all these parameters to know about irradiators.

EEE Components, PASSIVES

Advances in Film Resistor Technology

Posted by doEEEt Media Group
On October 14, 2020
0

Film resistor technologies have come a long way since metalised glass and cracked carbon films were offered as alternatives to the bulk material approaches of wirewound and composition

ACTIVES, EEE Components, PASSIVES, RF & MW, SPECIFICATIONS / QPLs

Issue 204 of ESCC QUALIFIED PART LIST (QPL)

Posted by Emilio Cano García
On March 17, 2020
0

The changes in issue 204 of ESCC QUALIFIED PART LIST (QPL) are included in the DCR 1325 and detailed herein below

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