Power potentiometers are as a rule wirewound. They are wound on a ceramic body and lack, due to heat dissipation concerns, encapsulation in casings or housings.
Lead integrity test is performed to determine the integrity of the device leads (terminals), welds and seals. During the execution of this test, the DUT is subjected to various stresses including tension, bending fatigue and torque. The stresses to be applied depend on the DUT characteristics and on the corresponding test method.
Coilcraft Power Inductors With Reduced DCR Available In Smaller Footprint Now
Coilcraft expanded its low DCR (up to 40% reduced) shielded power inductors by smaller footprint types – XGL3530
Memristors can potentially be made into non-volatile solid-state memory, which could allow greater data density than hard drives with access times similar to Dynamic Random Access Memory. A potential application of memristors is in analog memories for superconducting quantum computers.
The proposed Mott memristors also have the ability to reflect temperature-driven changes in resistance. Mott transition materials therefore vary between insulating and conducting according to their temperature, which can result in current spikes that resemble a neuron’s action potential.
PULSE LOADS
In many applications, the resistor will be subjected to pulse loads. We make distinctions between periodical/repetitive loads and pulse trains; on one hand, where the pulse is repeated at a certain frequency, and on the other separate pulses where a possible repetition will occur after so long time that the resistor has recovered its original ambient temperature.
3D Systems announced Airbus Defence and Space had selected the company to produce critical components for its industry-first satellite innovation, OneSat. 3D Systems’ Application Innovation Group (AIG) has designed an end-to-end additive manufacturing solution – comprising materials, 3D printing technology, software, and applications expertise – to produce the components required for the large antenna array on these satellites.
The HCTC Series features a solid carrier base for stable vertical PCB mounting and fixed-pin spacing for easy PCB insertion, high current capacity and excellent EMI suppression, which provides flexibility in the selection process with multiple options to choose from.
Encapsulation is the process to protect die from damage after die attach and wire bond. There are two main types of encapsulation: Glob Top and Dam and Fill.