PHYSICAL, MECHANICAL & ASSEMBLY, TESTING, WEBINAR

Scanning Acoustic Microscopy – Webinar

Posted by doEEEt Media Group
On June 17, 2020
2

This webinar provides a brief overview of Scanning Acoustic Microscopy and the inspection of EEE parts. Thus, you will acquire, in a friendly way, the knowledge to interpret SAM images and to conceive basic SAM inspections. The webinar is mainly focused on the plastic encapsulated systems. In addition, we will also show other interesting application examples.

ALTER Laboratory Services, INSPECTION, ELECTRICAL & VERIFICATION, Plastic Packaging for Space

Are there Voids in your IC Plastic Molding?

Posted by Raquel Cano Cordero
On November 10, 2021
0

Voids are defined as a lack of material within the bulk of the moulding compound and are common in ICs since they appear during improper molding manufacturing (injection, extrusion, etc.) and curation.

INSPECTION, ELECTRICAL & VERIFICATION, PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Crimped Connectors, What about Reliability and Testing?

Posted by Mari Carmen López
On January 13, 2020
1

Crimping together with wire wrapping and spring clip systems are the preferred alternatives for the solderless connection of electrical conductors. In particular, crimped connectors offer several advantages such as: Gas-tightness and protection against oxidation and corrosive environments, High mechanical strength is inherent to the lack of alloys in the mechanical joint, Large versatility in terms of the wire diameters.

Small Sats Testing

Component Testing for New Space Applications

Posted by Enrique Cordero
On July 2, 2021
0

This standard describes the differences and the minimum testing requirements necessary to each of these three classes for evaluation, screening, and lot acceptance. The following test sequence shows the evaluation test sequence for class 1 components, this sequence is the same in the three classes described in the standard with different severity and test conditions to each class.

EEE Components, Microsectioning - Short Technical Notes, PASSIVES, PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Microsectioning inspection of assembled capacitors

Posted by Mari Carmen López
On May 9, 2020
0

Cross-sectioned ceramic capacitors were metallographically prepared in the Materials & Processes Laboratory, recognized as a recommended facility for such activity by the ESA authority (MEMO ESA-TECMSP-MO-013165).

Posted by Elena Vallejo
On August 3, 2022
0

…

ALTER Laboratory Services, WEBINAR

SAM: Non-destructive inspection of plastic COTS parts and beyond

Posted by doEEEt Media Group
On June 14, 2021
0

The present communication reports about i) the suitability of advanced acoustic microscopy techniques for the screening of plastic COTS devices susceptible to experience catastrophic failures and ii) the applicability of this technique in the inspection and failure analysis of systems besides COTS such as PCBs, metallic assemblies, hermetic packages, electronic potting, RF devices, and others

Material & Processes Laboratory

Posted by doEEEt Media Group
On May 15, 2019
0

…

PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Soldering Verification of EEE parts SMD and PCBs

Posted by Mari Carmen López
On May 16, 2019
0

High reliability assembled PCB prototypes as well as novel surface mounted devices (SMD) and mixed systems must be assessed according to well defined qualification test plans. Such high reliability verification programmes are not limited to just evaluate the robustness, reliability and performance of the product but they also address the verification of tools, fabrication procedures and involved materials, as well as the confirmation of product integrity. For instance, ECSS (European Cooperation for Space Standardization” (ECSS) standards used in space programs

C SAM – Scanning Acoustic Microscopy

Posted by doEEEt Media Group
On December 30, 2019
0

…

Page 6 of 8«‹4 567 8 ›»