The Use of COTS Components for Space Applications
- Posted by Aimen Oeslaty
- On December 3, 2019
- 0
Comparison of the different tests & process done between COTS, AECQ, CECC & ESCC qualified products…
Vishay product range on Precision Resistors & Tantalum Capacitors >>>from COTS to ESCC products
RF Testing
- Posted by
- On July 16, 2024
- 0
The engineering team working in our RF testing lab gathers the necessary experience in the design, analysis, and test of microwave devices for any radio frequency technology.
The RF testing lab provides all the services required to meet the most…
EEE Components
- Posted by
- On July 16, 2024
- 0
According to ESA, Electrical, Electronic and Electro-mechanical (EEE) components are the fundamental building blocks of any spacecraft. It is one of ESA’s priorities to ensure the availability of suitable, reliable and cost-effective EEE components for the space industry.
What is…
New Space Microelectronics
- Posted by
- On July 16, 2024
- 0
New Space Microelectronics concept refers to the Space Industry, essentially space programs with reduced reliability, lifetime, and radiation requirements, compared to the traditional space.
New Space Microelectronics aims to reduce costs, time and weight under an acceptance possible risk and…
OpAmps in Plastic Packages
- Posted by Francisco Javier Aparicio Rebollo
- On December 17, 2020
- 0
Plastic encapsulated Op-amps are very popular due to the high availability and the diverse applications where they are implemented to. Nevertheless, they suffer from different risks being interfacial delamination and die attach anomalies the most critical ones. Scanning Acoustic inspection is the most suitable tool to avoid and...
MLCC cracking issues in low voltage is report & evaluates by NASA
- Posted by Tomáš Zedníček
- On May 15, 2019
- 0
Report prepared by Alexander Teverovsky, ASRC Federal Space and Defense. NASA recently released an extensive 70pages report on low voltage MLCC cracking issues published on nepp.nasa.gov. The report in detail describes the manufacturing process of MLCC types, provide comparative analyses of MIL, NASA vs ESA vs JAXA specifications, explains qualification procedures and cracking risk issues including degradation and failure mechanisms. The final section recommends methods for workmanship and failure detection.
Why Crimped Connector Mechanics Failure?
- Posted by Francisco Javier Aparicio Rebollo
- On September 21, 2020
- 0
Crimped connectors are extensively present in EEE systems because of the good performance and easier installation at reduced dimension.
Due to the key role played, they are required to have high durability even under harsh operating conditions. In the case of unexpected/early failure, thorough diagnosis and deep understanding of the main failure causes are the starting point to preclude future occurrence and improve the system reliability.
Hot Solder Dip Acceptance Criteria
- Posted by Antonio Rodríguez Arenas
- On December 20, 2019
- 0
Hot Solder Dip Acceptance Criteria for Flat Pack Packages.
Different standards can be considered to determine the acceptance of the Hot Solder Dip activity on EEE components