Robust X2 Capacitors for Automotive & High-Temperature Requirements

Posted by doEEEt Media Group
On June 23, 2021
0

The capacitance range of the B3292*P series ranges from 0.033 µF to 5.6 µF, and the maximum rated voltage is 305 V AC. Even under harsh environmental conditions, the capacitors offer a stable capacitance value, verified by the thermal humidity bias test with basic conditions of 85 °C, 85% relative humidity and an operating voltage of 240 V AC, for a duration of 500 hours.

ENDURANCE, ENVIRONMENTAL & RADIATION, TESTING

Know all the characteristics of a HAST test?

Posted by Álvaro Ricca Soaje
On February 21, 2019
0

HAST test reduces the time it takes to complete the typical humidity 85 ºC / 85% RH testing for semiconductors (96 HAST hours are equivalent to 1000 THB hours). By elevating temperatures above 100°C (usually up to 130°C) and increasing the pressure, simulation of normal humidity tests can be made while maintaining the same failure mechanisms.

EEE Components, PASSIVES

Five not-so-general-purpose MLCC

Posted by doEEEt Media Group
On June 3, 2019
0

The MLCC capacitor is one of the most widely used passive components today. Approximately 1000 billion multilayer ceramic capacitors are produced per year. Manufacturers have improved the electrical performance of these passive components through incremental progress in design, manufacturing methods, and materials.

EEE Components, PASSIVES

Top ten harsh environment resistors

Posted by doEEEt Media Group
On September 11, 2020
0

Here are 10 resistor lines introduced this year that deliver high reliability, high stability, or high temperature performance for a range of applications that require more robust performance.

ALTER Laboratory Services Brochures

Posted by doEEEt Media Group
On September 24, 2019
0

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ABC of CLR, EEE Components, PASSIVES, PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Hi-Rel EEE Parts Mounting Techniques Overview

Posted by Tomáš Zedníček
On April 30, 2019
0

IR reflow soldering IR infrared “convection” reflow is commonly used in commercial large volume SMD components mounting process. The main differences in reflow soldering processes and oven types lie in heat transfer methods – radiation, conduction, convection, and condensation. In fact, all heat transfers are used in modern reflow ovens. The heat is applied from above, below, or all directions dependent on the equipment being used. In classical infrared “radiation” reflow ovens, several ceramic heaters are transferring the heat to the assemblies, moving through the oven on a conveyor belt, by radiation.

Plastic Packaging for Space

OpAmps in Plastic Packages

Posted by Francisco Javier Aparicio Rebollo
On December 17, 2020
0

Plastic encapsulated Op-amps are very popular due to the high availability and the diverse applications where they are implemented to. Nevertheless, they suffer from different risks being interfacial delamination and die attach anomalies the most critical ones. Scanning Acoustic inspection is the most suitable tool to avoid and...

EEE Components, PASSIVES

How to read a capacitor data sheet

Posted by doEEEt Media Group
On November 7, 2020
0

The performance characteristics of any electronic component are included in product data sheets, which help designers and engineers to identify the properest component meeting the requirements of an application

INSPECTION, ELECTRICAL & VERIFICATION, TESTING

Non-destructive internal inspection of EEE parts and passive components

Posted by Francisco Javier Aparicio Rebollo
On July 7, 2020
0

Non-destructive testing methods are critical for the screening, inspection and failure analysis of plastic encapsulated and other EEE systems.

ABC of CLR, EEE Components, PASSIVES

Non-Wirewound Resistors: Film, Foil & Metal Oxide

Posted by Tomáš Zedníček
On January 6, 2021
1

Introduction to Film Resistors Film resistors are built either on cylindrical rods or on planar substrates. Usually, the material in the rods and substrates is ceramic in the state of aluminum oxide (alumina), but glass may occur. Hollow cores exist but are more and more abandoned when sizes are becoming smaller. This design suffers also from drawbacks: the construction is more fragile and the heat dissipation is poorer than that of a solid core.

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