EDAPS 2019
- Posted by doEEEt Media Group
- On July 11, 2019
- 0
The IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)symposium, a flagship event in the Asia-Pacific region, has consistently served as a platform for dissemination of latest research in the areas of electrical design of chip, package, and system. Designers and researchers across the world come forth to share and discuss their work on all aspects of electrical packaging including modeling, design and simulation, fabrication and characterization.