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INSPECTION, ELECTRICAL & VERIFICATION, PHYSICAL, MECHANICAL & ASSEMBLY, TESTING

Doing Failure Analysis in EEE Parts

  • Posted by Mari Carmen López
  • On March 29, 2020
  • 0
Failure analysis is the process of analysing the component data or the component itself to determine the reason(s) for degraded performance or catastrophic failure of a component either, during component manufacturing and testing, during incoming inspection, or after delivery to the customer, at the final application. Since there are an infinite number of variables in play at any one time, it is important as a first step in any failure analysis to understand how and when the failure occurred.
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INSPECTION, ELECTRICAL & VERIFICATION, TESTING

SAM Capabilities, Analyse the internal structure in EEE Parts

  • Posted by Francisco Javier Aparicio Rebollo
  • On February 24, 2021
  • 0
In acoustic microscopy, resolution and inspection depth is an inversely related parameter that depends on the probe frequency and the characteristics of the involved materials. Therefore, the inspection frequency must be carefully selected in order to optimize the accuracy without decreasing the inspection depth below the specimen thickness. Suitable selection of the inspection parameters provides: Detection of ultra-thin (submicrometric) delamination in multilayer systems. Micrometric lateral resolution. In acoustic microscopy, resolution and inspection depth is an inversely related parameter that depends on the probe frequency and the characteristics of the involved materials.
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EEE Components, PASSIVES

MLCC cracking issues in low voltage is report & evaluates by NASA

  • Posted by Tomáš Zedníček
  • On May 15, 2019
  • 0
Report prepared by Alexander Teverovsky, ASRC Federal Space and Defense. NASA recently released an extensive 70pages report on low voltage MLCC cracking issues published on nepp.nasa.gov. The report in detail describes the manufacturing process of MLCC types, provide comparative analyses of MIL, NASA vs ESA vs JAXA specifications, explains qualification procedures and cracking risk issues including degradation and failure mechanisms. The final section recommends methods for workmanship and failure detection.
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C-SAM - Short Technical Notes, EEE Components, PASSIVES, TESTING

Acoustic Inspection of Hybrid Systems on Laminated Substrates

  • Posted by Francisco Javier Aparicio Rebollo
  • On September 3, 2019
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BGA device assembled to a PCB has been submitted to the ECSS verification programme following the guideline defined in the ECSS standard ECSS-Q-ST-70-38C. Metallographic analysis allows us to check the status of such devices after performing the environmental tests (Vibration & Thermal Cycling).
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