C-SAM Questions & Answers
- Posted by Francisco Javier Aparicio Rebollo
- On July 7, 2020
- 0
In this post, you can read all the questions launched by the attendees, as well as all the answers offered by the speaker.
ESR Degradation in Polymer Tantalum Capacitors during Hi Temp Storage
- Posted by doEEEt Media Group
- On December 27, 2020
- 0
Different types of polymer capacitors from three manufacturers have been stored at temperatures from 100 ºC for periods up to 18,500 hours to 175 ºC for up to 2000 hours.
SAM, the preferred method for the non-destructive internal inspection
- Posted by doEEEt Media Group
- On December 16, 2020
- 0
SAM, The Preferred Method For The Non-Destructive Internal Inspection. Scanning Acoustic Microscopy of COTS and plastic encapsulated microelectronics.
Confocal Scanning Acoustic Microscopy (C-SAM) has proved to be the most effective non-destructive approach for the screening of COTS parts and the detection of latent internal anomalies in PEMs, either before soldering or for assembled systems.
Mission Profile Evaluation for Automotive Applications An Anthology of Best Practices
- Posted by Semyra Vasquez-Borucki
- On December 3, 2019
- 0
The integrated circuits (ICs) to be applied in the automobile industry are qualified according to the Automobile Electronic Council AEC Q100 standard. Since 2014 the AEC Q100 Rev H requests the assessment of mission profiles in close relation between Original Equipment Manufacturers (OEM) and / or the Tier 1s (intermediary industry, supplying directly the OEMs) and the IC manufacturer.
A mission profile is the collection of relevant environment conditions, in which the IC will be exposed in a defined application. In this presentation, an anthology of best practices aimed for evaluating mission profiles of ICs for the automobile industry is shown.
An overview of the most applied models for thermal, thermo-mechanical and humidity loads is presented. The benefit of applying this method is to perform reliability predictions for targeted applications. The operation of a sensor in a car is taken as an example.
Quality Issues in the procurement of Operational Amplifiers
- Posted by Antonio Rodríguez Arenas
- On April 20, 2021
- 0
The Quality Assurance in EEE parts is a major aspect to take care in the procurement for EEE parts. One family of EEE parts widely used are the Operational Amplifiers which are in much different equipment’s of satellites electronics
Non-destructive internal inspection of EEE parts and passive components
- Posted by Francisco Javier Aparicio Rebollo
- On July 7, 2020
- 0
Non-destructive testing methods are critical for the screening, inspection and failure analysis of plastic encapsulated and other EEE systems.
Scanning Microscopy Equipment our new adquisition
- Posted by Francisco Javier Aparicio Rebollo
- On December 13, 2021
- 0
ALTER TECHNOLGY upgrades its Scanning Acoustic Microscopy capabilities.
Alter Technology has upgraded its Scanning Acoustic Microscopy capabilities by acquiring a new FineSAT V acoustic microscope from Hitachi.
FineSAT V, the high-end model of the FineSAT series, combines advanced inspection features with the faster inspection speed currently available in the market.
Alter Technology SAM Additional Testing Capabilities
- Posted by Francisco Javier Aparicio Rebollo
- On January 29, 2020
- 0
Among the test flow where SAM microscopy is used, other tests are carried out in which Alter Technology also has extensive experience, giving its customers the possibility of doing all the necessary tests with our expert engineers, offering support and follow-up at all times thanks to Virtual Lab; where immediate access is generated and in real time to all the information on the parts examined.
SAM: Test flow and procedures
- Posted by Francisco Javier Aparicio Rebollo
- On September 17, 2020
- 0
Nowadays scanning acoustic microscopy (SAM) is extensively used in the non-destructive inspection of microelectronic devices and is present in different space verification programs; particularly for plastic-encapsulated electronic components. This is so due to the ability to image the internal morphology, location, size and distribution of hidden features including different types of flaws.
C-SAM - Short Technical Notes, INSPECTION, ELECTRICAL & VERIFICATION, Plastic Packaging for Space, TESTING
Inspection of thick EEE plastic encapsulated parts – CSAM Services
- Posted by Francisco Javier Aparicio Rebollo
- On June 27, 2019
- 0
High-resolution inspection of plastic encapsulated systems with complex internal architectures requires of confocal imaging techniques to block out-of-focus features that otherwise impair the resolution and the image quality.